Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm{2}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].

Original languageEnglish
Title of host publication2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
EditorsJan van der Spiegel
Place of PublicationPiscataway, NJ
Number of pages3
ISBN (Electronic)978-1-5386-8531-0
ISBN (Print)978-1-5386-8532-7
Publication statusPublished - 2019
EventISSCC 2019: IEEE International Solid-State Circuits Conference - San Francisco, CA, United States
Duration: 17 Feb 201921 Feb 2019


ConferenceISSCC 2019
CountryUnited States
CitySan Francisco, CA

    Research areas

  • Temperature sensors, Temperature measurement, Modulation, Switches, 1/f noise, Ovens, Sensitivity

ID: 52988282