Abstract
Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm{2}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].
Original language | English |
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Title of host publication | 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 |
Editors | Jan van der Spiegel |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 186-188 |
Number of pages | 3 |
Volume | 2019-February |
ISBN (Electronic) | 978-1-5386-8531-0 |
ISBN (Print) | 978-1-5386-8532-7 |
DOIs | |
Publication status | Published - 2019 |
Event | ISSCC 2019: IEEE International Solid-State Circuits Conference - San Francisco, CA, United States Duration: 17 Feb 2019 → 21 Feb 2019 |
Conference
Conference | ISSCC 2019 |
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Country/Territory | United States |
City | San Francisco, CA |
Period | 17/02/19 → 21/02/19 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Session 10.4
Keywords
- Temperature sensors
- Temperature measurement
- Modulation
- Switches
- 1/f noise
- Ovens
- Sensitivity