Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
Aging of epoxy moulding compound : Thermomechanical properties during high temperature storage. / Zhang, Bingbing; Johlitz, Micheal; Lion, Alexander; Ernst, Leo; Jansen, Kaspar; Vu, Duc-Khoi; Weiss, Laurens.
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway : IEEE Society, 2016. p. 1-6.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
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TY - GEN
T1 - Aging of epoxy moulding compound
T2 - Thermomechanical properties during high temperature storage
AU - Zhang, Bingbing
AU - Johlitz, Micheal
AU - Lion, Alexander
AU - Ernst, Leo
AU - Jansen, Kaspar
AU - Vu, Duc-Khoi
AU - Weiss, Laurens
PY - 2016
Y1 - 2016
N2 - It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.
AB - It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.
KW - Aging (Materials)
KW - Electromagnetic compatibility
KW - Temperature measurement
KW - Temperature
KW - High temperature superconductors
KW - Oxidation
KW - Material properties
U2 - 10.1109/EuroSimE.2016.7463394
DO - 10.1109/EuroSimE.2016.7463394
M3 - Conference contribution
SN - 978-1-5090-2106-2
SP - 1
EP - 6
BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
PB - IEEE Society
CY - Piscataway
ER -
ID: 9160990