Standard

Aging of epoxy moulding compound : Thermomechanical properties during high temperature storage. / Zhang, Bingbing; Johlitz, Micheal; Lion, Alexander; Ernst, Leo; Jansen, Kaspar; Vu, Duc-Khoi; Weiss, Laurens.

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway : IEEE Society, 2016. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Zhang, B, Johlitz, M, Lion, A, Ernst, L, Jansen, K, Vu, D-K & Weiss, L 2016, Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage. in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. IEEE Society, Piscataway, pp. 1-6, EuroSimE 2016, Montpellier, France, 17/04/16. https://doi.org/10.1109/EuroSimE.2016.7463394

APA

Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K., & Weiss, L. (2016). Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference (pp. 1-6). Piscataway: IEEE Society. https://doi.org/10.1109/EuroSimE.2016.7463394

Vancouver

Zhang B, Johlitz M, Lion A, Ernst L, Jansen K, Vu D-K et al. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway: IEEE Society. 2016. p. 1-6 https://doi.org/10.1109/EuroSimE.2016.7463394

Author

Zhang, Bingbing ; Johlitz, Micheal ; Lion, Alexander ; Ernst, Leo ; Jansen, Kaspar ; Vu, Duc-Khoi ; Weiss, Laurens. / Aging of epoxy moulding compound : Thermomechanical properties during high temperature storage. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway : IEEE Society, 2016. pp. 1-6

BibTeX

@inproceedings{882ae06f8a17491fa9ff62b4e2177282,
title = "Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage",
abstract = "It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.",
keywords = "Aging (Materials), Electromagnetic compatibility, Temperature measurement, Temperature, High temperature superconductors, Oxidation, Material properties",
author = "Bingbing Zhang and Micheal Johlitz and Alexander Lion and Leo Ernst and Kaspar Jansen and Duc-Khoi Vu and Laurens Weiss",
year = "2016",
doi = "10.1109/EuroSimE.2016.7463394",
language = "English",
isbn = "978-1-5090-2106-2",
pages = "1--6",
booktitle = "Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",
publisher = "IEEE Society",

}

RIS

TY - GEN

T1 - Aging of epoxy moulding compound

T2 - Thermomechanical properties during high temperature storage

AU - Zhang, Bingbing

AU - Johlitz, Micheal

AU - Lion, Alexander

AU - Ernst, Leo

AU - Jansen, Kaspar

AU - Vu, Duc-Khoi

AU - Weiss, Laurens

PY - 2016

Y1 - 2016

N2 - It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.

AB - It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.

KW - Aging (Materials)

KW - Electromagnetic compatibility

KW - Temperature measurement

KW - Temperature

KW - High temperature superconductors

KW - Oxidation

KW - Material properties

U2 - 10.1109/EuroSimE.2016.7463394

DO - 10.1109/EuroSimE.2016.7463394

M3 - Conference contribution

SN - 978-1-5090-2106-2

SP - 1

EP - 6

BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - IEEE Society

CY - Piscataway

ER -

ID: 9160990