An adaptive Cu trace fatigue model based on average cross-section strain

DM Farley, Y Zhou, A Dasgupta, JWC de Vries

Research output: Contribution to journal › Article › Scientific

1 Citation (Scopus)

Original language	English
Pages (from-to)	2763-2772
Number of pages	10
Journal	Microelectronics Reliability
Volume	52
Issue number	11
DOIs	https://doi.org/10.1016/j.microrel.2012.06.114
Publication status	Published - 2013

Keywords

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title = "An adaptive Cu trace fatigue model based on average cross-section strain",

keywords = "academic journal papers, CWTS JFIS < 0.75",

author = "DM Farley and Y Zhou and A Dasgupta and {de Vries}, JWC",

year = "2013",

doi = "10.1016/j.microrel.2012.06.114",

language = "English",

volume = "52",

pages = "2763--2772",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

number = "11",

}

TY - JOUR

T1 - An adaptive Cu trace fatigue model based on average cross-section strain

AU - Farley, DM

AU - Zhou, Y

AU - Dasgupta, A

AU - de Vries, JWC

PY - 2013

Y1 - 2013

KW - academic journal papers

KW - CWTS JFIS < 0.75

U2 - 10.1016/j.microrel.2012.06.114

DO - 10.1016/j.microrel.2012.06.114

M3 - Article

SN - 0026-2714

VL - 52

SP - 2763

EP - 2772

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 11

ER -