With the increased use of mobile phones, navigation systems, PDA's, laptops and portable gaming devices, the drop reliability of microelectronics has become an important parameter. Assessing the solder interconnect quality by means of drop impact testing, as standardized by e.g. JEDEC, during normal production requires considerable amounts of time and effort. Besides this, the repeatability of the drop impact test is low and introduces elaborate and time-consuming analysis of the results after testing. Already many researchers have investigated new test techniques capable of replacing the drop impact test, e.g. high-speed shear, pull and bending. Among those tests is the High Speed Cold Bump Pull test (HSCBP or CBP). In the CBP test the solder bump is pulled in vertical direction from the die using a smal pair of jaws. In this test, by varying the pull speed several different strain-rates can be applied to the solder bump. In our research a correlation between the drop impact test and cold bump pull test is investigated. This can be divided into three parts. First by investigating the cold bump pull test apparatus for uncontrolled parameters that might introduce a bias or spread in the results. Secondly by means of modeling the cold bump pull test to investigate solder bump deformation and solder bump loading during pull-off. Finally, the differences and simularities between the drop impact test and the cold bump pull test are briefly discussed and some observations concerning the solder joint performance are presented.
Original languageUndefined/Unknown
Title of host publication2008 Proceedings 58th Electronic Components & Technology Conference
Editors Wipiejewski, T., Trewhella, J.
Place of PublicationOrlando, FL, USA
PublisherIEEE Society
Pages1181-1186
Number of pages6
ISBN (Print)978-1-4244-2231-9
Publication statusPublished - 2008
Event58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA
Duration: 27 May 200830 May 2008

Publication series

Name
PublisherIEEE

Conference

Conference58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period27/05/0830/05/08

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3036992