An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

R Kregting, RBR van Silfhout, O van der Sluis, RAB Engelen, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors Sheng Liu
Place of PublicationShanghai, China
PublisherInstitute of Electrical and Electronic Engineers (IEEE)
Pages210-215
Number of pages6
ISBN (Print)1-4244-0620-X
Publication statusPublished - 2006
Event2006 7th International Conference on Electronics Packaging Technology - Shanghai. China
Duration: 26 Aug 200629 Aug 2006

Publication series

Name
PublisherInstitute of Electrical and Electronic Engineers, Inc.

Conference

Conference2006 7th International Conference on Electronics Packaging Technology
Period26/08/0629/08/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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