@inproceedings{2c7ddeb545b34f49b3569a707ec6cadf,
title = "An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "R Kregting and {van Silfhout}, RBR and {van der Sluis}, O and RAB Engelen and {van Driel}, WD and GQ Zhang",
year = "2006",
language = "Undefined/Unknown",
isbn = "1-4244-0620-X",
publisher = "Institute of Electrical and Electronic Engineers (IEEE)",
pages = "210--215",
editor = "{Sheng Liu}",
booktitle = "Proceedings of 2006 7th International Conference on Electronics Packaging Technology",
note = "2006 7th International Conference on Electronics Packaging Technology ; Conference date: 26-08-2006 Through 29-08-2006",
}