Analytical model for predicting thermal bridge effects due to vacuum insulation panel barrier envelopes

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Keywords

@article{2d571bf207714ee0a0cb496743825d97,

title = "Analytical model for predicting thermal bridge effects due to vacuum insulation panel barrier envelopes",

keywords = "Vakpubl., Overig wet. > 3 pag",

author = "MJ Tenpierik and {van der Spoel}, WH and JJM Cauberg",

year = "2008",

language = "Undefined/Unknown",

volume = "30",

pages = "38--45",

journal = "Bauphysik",

issn = "0171-5445",

publisher = "John Wiley & Sons",

}

TY - JOUR

T1 - Analytical model for predicting thermal bridge effects due to vacuum insulation panel barrier envelopes

AU - Tenpierik, MJ

AU - van der Spoel, WH

AU - Cauberg, JJM

PY - 2008

Y1 - 2008

KW - Vakpubl., Overig wet. > 3 pag

UR - http://www3.interswcience.wiley.com/journal/117923918/abstract?CRETY=1&SRETRY=0

M3 - Article

SN - 0171-5445

VL - 30

SP - 38

EP - 45

JO - Bauphysik

JF - Bauphysik

ER -