@inproceedings{cc183a4e1c824322a5884cefcd1d1383,
title = "Analytical solution for moisture-induced interface delamination in electronic packaging",
keywords = "Conf.proc. > 3 pag",
author = "X Fan and GQ Zhang and {van Driel}, W and LJ Ernst",
year = "2003",
language = "Undefined/Unknown",
isbn = "0-7803-7991-5",
publisher = "IEEE Society",
pages = "733--738",
editor = "SK Sitaraman and M Lamson",
booktitle = "53rd electronic components & technology conference",
note = "53rd electronic components & technology conference ; Conference date: 27-05-2003 Through 30-05-2003",
}