Analytical thermal modeling of flip-chip mounted semiconductor optical amplifiers

FM De Paola; V d' Alessandro; F Tamigi; N Rinaldi

Analytical thermal modeling of flip-chip mounted semiconductor optical amplifiers

FM De Paola, V d' Alessandro, F Tamigi, N Rinaldi

Microelectronics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings, European Microelectronics and Packaging Symposium
Place of Publication	Prague
Publisher	IMAPS CZ&SK
Pages	207-212
Number of pages	6
ISBN (Print)	80-239-2835-X
Publication status	Published - 2004
Event	European Microelectronics and Packaging Symposium, Prague, Czech Republic - Prague Duration: 16 Jun 2004 → 18 Jun 2004

Publication series

Name
Publisher	IMAPS CZ&SK

Conference

Conference	European Microelectronics and Packaging Symposium, Prague, Czech Republic
Period	16/06/04 → 18/06/04

Bibliographical note

ed. is niet bekend

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{e703cc6a5bad4ce5ad8bd83cb19e1059,

title = "Analytical thermal modeling of flip-chip mounted semiconductor optical amplifiers",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{De Paola}, FM and {d' Alessandro}, V and F Tamigi and N Rinaldi",

note = "ed. is niet bekend; European Microelectronics and Packaging Symposium, Prague, Czech Republic ; Conference date: 16-06-2004 Through 18-06-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "80-239-2835-X",

publisher = "IMAPS CZ&SK",

pages = "207--212",

booktitle = "Proceedings, European Microelectronics and Packaging Symposium",

}

TY - GEN

T1 - Analytical thermal modeling of flip-chip mounted semiconductor optical amplifiers

AU - De Paola, FM

AU - d' Alessandro, V

AU - Tamigi, F

AU - Rinaldi, N

N1 - ed. is niet bekend

PY - 2004

Y1 - 2004

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 80-239-2835-X

SP - 207

EP - 212

BT - Proceedings, European Microelectronics and Packaging Symposium

PB - IMAPS CZ&SK

CY - Prague

T2 - European Microelectronics and Packaging Symposium, Prague, Czech Republic

Y2 - 16 June 2004 through 18 June 2004

ER -