@inproceedings{27f2b0f75bba4b7b8f45637952ba38a7,
title = "Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments",
author = "I Maus and H Preu and M Niessner and M Fink and KMB Jansen and R Pantou and B Michel and B Wunderle",
year = "2014",
doi = "10.1109/EuroSimE.2014.6813833",
language = "English",
isbn = "978-1-4799-4791-1",
pages = "1--7",
editor = "B Vandevelde",
booktitle = "Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems",
publisher = "IEEE Society",
note = "EuroSimE 2014 : IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 07-04-2014 Through 09-04-2014",
}