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Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound. / Sadeghinia, M; Jansen, KMB; Ernst, LJ.

In: International Journal of Adhesion and Adhesives, Vol. 32, 2011, p. 82-88.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Sadeghinia, M, Jansen, KMB & Ernst, LJ 2011, 'Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound' International Journal of Adhesion and Adhesives, vol. 32, pp. 82-88.

APA

Sadeghinia, M., Jansen, KMB., & Ernst, LJ. (2011). Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound. International Journal of Adhesion and Adhesives, 32, 82-88.

Vancouver

Sadeghinia M, Jansen KMB, Ernst LJ. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound. International Journal of Adhesion and Adhesives. 2011;32:82-88.

Author

Sadeghinia, M ; Jansen, KMB ; Ernst, LJ. / Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound. In: International Journal of Adhesion and Adhesives. 2011 ; Vol. 32. pp. 82-88.

BibTeX

@article{aa40480bbb3341c58a029a4fedf2ec38,
title = "Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound",
abstract = "Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation, stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. In this paper, the thermo-mechanical properties of an epoxy molding compound with and without filler are investigated both experimentally and theoretically. The cure-dependent properties of the EMCs, likewise, the cure kinetics, coefficient of thermal expansion and cure shrinkage were measured using a Differential Scanning Calorimetry (DSC) and GNOMIX high pressure dilatometer. In addition using a Dynamic Mechanical Analyzer (DMA) the time and temperature dependent storage modulus was measured and mastercurves were constructed.",
keywords = "academic journal papers, CWTS 0.75 <= JFIS < 2.00",
author = "M Sadeghinia and KMB Jansen and LJ Ernst",
year = "2011",
language = "English",
volume = "32",
pages = "82--88",
journal = "International Journal of Adhesion and Adhesives",
issn = "0143-7496",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2011

Y1 - 2011

N2 - Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation, stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. In this paper, the thermo-mechanical properties of an epoxy molding compound with and without filler are investigated both experimentally and theoretically. The cure-dependent properties of the EMCs, likewise, the cure kinetics, coefficient of thermal expansion and cure shrinkage were measured using a Differential Scanning Calorimetry (DSC) and GNOMIX high pressure dilatometer. In addition using a Dynamic Mechanical Analyzer (DMA) the time and temperature dependent storage modulus was measured and mastercurves were constructed.

AB - Semi-conductor devices are mostly encapsulated by epoxy molding compound (EMC) materials. During encapsulation, stresses are generated due to the curing of the molding compound. Moreover, additional stresses will build up during cooling down from molding to ambient temperature caused by the differences in the coefficient of thermal expansion. These residual stresses add up to the stresses generated during mechanical loading and may lead to product failure. The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. In this paper, the thermo-mechanical properties of an epoxy molding compound with and without filler are investigated both experimentally and theoretically. The cure-dependent properties of the EMCs, likewise, the cure kinetics, coefficient of thermal expansion and cure shrinkage were measured using a Differential Scanning Calorimetry (DSC) and GNOMIX high pressure dilatometer. In addition using a Dynamic Mechanical Analyzer (DMA) the time and temperature dependent storage modulus was measured and mastercurves were constructed.

KW - academic journal papers

KW - CWTS 0.75 <= JFIS < 2.00

M3 - Article

VL - 32

SP - 82

EP - 88

JO - International Journal of Adhesion and Adhesives

T2 - International Journal of Adhesion and Adhesives

JF - International Journal of Adhesion and Adhesives

SN - 0143-7496

ER -

ID: 2549885