Abstract
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.
Original language | English |
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Title of host publication | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 |
Publisher | IEEE |
Pages | 1-7 |
Number of pages | 7 |
ISBN (Electronic) | 978-1-5090-4344-6 |
ISBN (Print) | 978-1-5090-4345-3 |
DOIs | |
Publication status | Published - 2017 |
Event | 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany Duration: 3 Apr 2017 → 5 Apr 2017 |
Conference
Conference | 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 |
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Country/Territory | Germany |
City | Dresden |
Period | 3/04/17 → 5/04/17 |
Keywords
- Temperature measurement
- Microassembly
- Curing
- Material properties
- Temperature distribution
- Heating Systems