• I. Maus
  • C. Liebl
  • M. Fink
  • Duc-Khoi Vu
  • M. Hartung
  • H. Preu
  • Kaspar Jansen
  • B. Michel
  • B Wunderle
  • Laurens Weiss

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

Original languageEnglish
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PublisherIEEE
Pages1-7
Number of pages7
ISBN (Electronic)978-1-5090-4344-6
ISBN (Print)978-1-5090-4345-3
DOIs
Publication statusPublished - 2017
EventEuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Conference

ConferenceEuroSimE 2017
CountryGermany
CityDresden
Period3/04/175/04/17

    Research areas

  • Temperature measurement, Microassembly, Curing, Material properties, Temperature distribution, Heating Systems

ID: 26615961