Standard

Characterization of epoxy based highly filled die attach materials in microelectronics. / Maus, I.; Liebl, C.; Fink, M.; Vu, Duc-Khoi; Hartung, M.; Preu, H.; Jansen, Kaspar; Michel, B.; Wunderle, B; Weiss, Laurens.

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, 2017. p. 1-7 7926237.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Maus, I, Liebl, C, Fink, M, Vu, D-K, Hartung, M, Preu, H, Jansen, K, Michel, B, Wunderle, B & Weiss, L 2017, Characterization of epoxy based highly filled die attach materials in microelectronics. in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017., 7926237, IEEE, pp. 1-7, 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017, Dresden, Germany, 3/04/17. https://doi.org/10.1109/EuroSimE.2017.7926237

APA

Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B., & Weiss, L. (2017). Characterization of epoxy based highly filled die attach materials in microelectronics. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 (pp. 1-7). [7926237] IEEE. https://doi.org/10.1109/EuroSimE.2017.7926237

Vancouver

Maus I, Liebl C, Fink M, Vu D-K, Hartung M, Preu H et al. Characterization of epoxy based highly filled die attach materials in microelectronics. In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE. 2017. p. 1-7. 7926237 https://doi.org/10.1109/EuroSimE.2017.7926237

Author

Maus, I. ; Liebl, C. ; Fink, M. ; Vu, Duc-Khoi ; Hartung, M. ; Preu, H. ; Jansen, Kaspar ; Michel, B. ; Wunderle, B ; Weiss, Laurens. / Characterization of epoxy based highly filled die attach materials in microelectronics. 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, 2017. pp. 1-7

BibTeX

@inproceedings{a2c85dd7e7734eb9ad99e9dbb75d0ae0,
title = "Characterization of epoxy based highly filled die attach materials in microelectronics",
abstract = "In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.",
keywords = "Temperature measurement, Microassembly, Curing, Material properties, Temperature distribution, Heating Systems",
author = "I. Maus and C. Liebl and M. Fink and Duc-Khoi Vu and M. Hartung and H. Preu and Kaspar Jansen and B. Michel and B Wunderle and Laurens Weiss",
year = "2017",
doi = "10.1109/EuroSimE.2017.7926237",
language = "English",
isbn = "978-1-5090-4345-3 ",
pages = "1--7",
booktitle = "2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017",
publisher = "IEEE",
address = "United States",
note = "18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 03-04-2017 Through 05-04-2017",

}

RIS

TY - GEN

T1 - Characterization of epoxy based highly filled die attach materials in microelectronics

AU - Maus, I.

AU - Liebl, C.

AU - Fink, M.

AU - Vu, Duc-Khoi

AU - Hartung, M.

AU - Preu, H.

AU - Jansen, Kaspar

AU - Michel, B.

AU - Wunderle, B

AU - Weiss, Laurens

PY - 2017

Y1 - 2017

N2 - In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

AB - In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

KW - Temperature measurement

KW - Microassembly

KW - Curing

KW - Material properties

KW - Temperature distribution

KW - Heating Systems

UR - http://www.scopus.com/inward/record.url?scp=85020222784&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2017.7926237

DO - 10.1109/EuroSimE.2017.7926237

M3 - Conference contribution

AN - SCOPUS:85020222784

SN - 978-1-5090-4345-3

SP - 1

EP - 7

BT - 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

PB - IEEE

T2 - 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

Y2 - 3 April 2017 through 5 April 2017

ER -

ID: 26615961