Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures

HW van Zeijl; JHCM Slabbekoorn

Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures

HW van Zeijl, JHCM Slabbekoorn

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Smart Sensors, Actuators, and MEMS
Editors	JC Chiao, VK Varadan, C Cané
Place of Publication	Bellingham, WA, USA
Publisher	SPIE
Pages	617-626
Number of pages	10
ISBN (Print)	0-8194-4976-8
Publication status	Published - 2003
Event	Microtechnologies for the New Millennium 2003, Maspalomas, Spain - Bellingham, WA, USA Duration: 19 May 2003 → 21 May 2003

Publication series

Name
Publisher	SPIE

Conference

Conference	Microtechnologies for the New Millennium 2003, Maspalomas, Spain
Period	19/05/03 → 21/05/03

Keywords

Elektrotechniek
Techniek
Conf.proc. > 3 pag

Cite this

@inproceedings{fa21d45c36eb4303886b02b3427ef2fa,

title = "Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures",

keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",

author = "{van Zeijl}, HW and JHCM Slabbekoorn",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-8194-4976-8",

publisher = "SPIE",

pages = "617--626",

editor = "JC Chiao and VK Varadan and C Can{\'e}",

booktitle = "Smart Sensors, Actuators, and MEMS",

address = "United States",

note = "Microtechnologies for the New Millennium 2003, Maspalomas, Spain ; Conference date: 19-05-2003 Through 21-05-2003",

}

Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures. / van Zeijl, HW; Slabbekoorn, JHCM.
Smart Sensors, Actuators, and MEMS. ed. / JC Chiao; VK Varadan; C Cané. Bellingham, WA, USA: SPIE, 2003. p. 617-626.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Characterization of front-to backwafer alignment and bulk micromachining using electrical overlay test structures

AU - van Zeijl, HW

AU - Slabbekoorn, JHCM

PY - 2003

Y1 - 2003

KW - Elektrotechniek

KW - Techniek

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-8194-4976-8

SP - 617

EP - 626

BT - Smart Sensors, Actuators, and MEMS

A2 - Chiao, JC

A2 - Varadan, VK

A2 - Cané, C

PB - SPIE

CY - Bellingham, WA, USA

T2 - Microtechnologies for the New Millennium 2003, Maspalomas, Spain

Y2 - 19 May 2003 through 21 May 2003

ER -