@article{5cc6470bfb7e4a3bbc70182b340e8ed7,
title = "Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering",
author = "Y Liu and J Zhao and CCA Yuan and GQ Zhang and F Sun",
note = "Harvest Published 1-10-2014",
year = "2014",
doi = "10.1109/TCPMT.2014.2358266",
language = "English",
volume = "4",
pages = "1754--1759",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
number = "11",
}