CMOS thermopiles for wafer-thick wind sensor

SP Matova; KAA Makinwa; JH Huijsing

CMOS thermopiles for wafer-thick wind sensor

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1
Editors	et al., DR Ivanov
Place of Publication	Sofia
Publisher	Technical University Sofia
Pages	89-94
Number of pages	6
ISBN (Print)	954-9518-156-9
Publication status	Published - 2001
Event	Tenth international scientific and applied science conference alectronics ET'2001 - Sofia Duration: 26 Sept 2001 → 28 Sept 2001

Publication series

Name
Publisher	Technical University Sofia

Name
Volume	89

Conference

Conference	Tenth international scientific and applied science conference alectronics ET'2001
Period	26/09/01 → 28/09/01

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{d1f405145705432b805fd3d69bdc9ab5,

title = "CMOS thermopiles for wafer-thick wind sensor",

keywords = "Conf.proc. > 3 pag",

author = "SP Matova and KAA Makinwa and JH Huijsing",

year = "2001",

language = "Undefined/Unknown",

isbn = "954-9518-156-9",

publisher = "Technical University Sofia",

pages = "89--94",

editor = "{et al.} and DR Ivanov",

booktitle = "The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1",

note = "Tenth international scientific and applied science conference alectronics ET'2001 ; Conference date: 26-09-2001 Through 28-09-2001",

}

Matova, SP, Makinwa, KAA & Huijsing, JH 2001, CMOS thermopiles for wafer-thick wind sensor. in et al. & DR Ivanov (eds), The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1. Technical University Sofia, Sofia, pp. 89-94, Tenth international scientific and applied science conference alectronics ET'2001, 26/09/01.

CMOS thermopiles for wafer-thick wind sensor. / Matova, SP; Makinwa, KAA ; Huijsing, JH.
The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1. ed. / et al.; DR Ivanov. Sofia: Technical University Sofia, 2001. p. 89-94.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - CMOS thermopiles for wafer-thick wind sensor

AU - Matova, SP

AU - Makinwa, KAA

AU - Huijsing, JH

PY - 2001

Y1 - 2001

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 954-9518-156-9

SP - 89

EP - 94

BT - The tenth international scientific and applied science conference electronics ET'2001; proceedings of the conference book 1

A2 - et al., null

A2 - Ivanov, DR

PB - Technical University Sofia

CY - Sofia

T2 - Tenth international scientific and applied science conference alectronics ET'2001

Y2 - 26 September 2001 through 28 September 2001

ER -