CNT bundles growth on microhotplates for direct measurement of their thermal properties

C Silvestri; B Morana; G Fiorentino; S Vollebregt; G Pandraud; F Santagata; GQ Zhang; PM Sarro

doi:10.1109/MEMSYS.2014.6765570

CNT bundles growth on microhotplates for direct measurement of their thermal properties

C Silvestri, B Morana, G Fiorentino, S Vollebregt, G Pandraud, F Santagata, GQ Zhang, PM Sarro

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems
Editors	F Ayazi, CJ Kim
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	48-51
Number of pages	4
ISBN (Print)	978-1-4799-3508-6
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765570
Publication status	Published - 2014
Event	IEEE MEMS 2014, San Francisco, CA, USA - Piscataway, NJ, USA Duration: 26 Jan 2014 → 30 Jan 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE MEMS 2014, San Francisco, CA, USA
Period	26/01/14 → 30/01/14

Bibliographical note

Harvest

Access to Document

10.1109/MEMSYS.2014.6765570

Cite this

Silvestri, C., Morana, B., Fiorentino, G., Vollebregt, S., Pandraud, G., Santagata, F., Zhang, GQ., & Sarro, PM. (2014). CNT bundles growth on microhotplates for direct measurement of their thermal properties. In F. Ayazi, & CJ. Kim (Eds.), Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (pp. 48-51). IEEE Society. https://doi.org/10.1109/MEMSYS.2014.6765570

@inproceedings{161902c97cd84283a847d0b316a4f77d,

title = "CNT bundles growth on microhotplates for direct measurement of their thermal properties",

author = "C Silvestri and B Morana and G Fiorentino and S Vollebregt and G Pandraud and F Santagata and GQ Zhang and PM Sarro",

note = "Harvest; IEEE MEMS 2014, San Francisco, CA, USA ; Conference date: 26-01-2014 Through 30-01-2014",

year = "2014",

doi = "10.1109/MEMSYS.2014.6765570",

language = "English",

isbn = "978-1-4799-3508-6",

publisher = "IEEE Society",

pages = "48--51",

editor = "F Ayazi and CJ Kim",

booktitle = "Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems",

}

Silvestri, C , Morana, B, Fiorentino, G, Vollebregt, S, Pandraud, G, Santagata, F, Zhang, GQ & Sarro, PM 2014, CNT bundles growth on microhotplates for direct measurement of their thermal properties. in F Ayazi & CJ Kim (eds), Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. IEEE Society, Piscataway, NJ, USA, pp. 48-51, IEEE MEMS 2014, San Francisco, CA, USA, 26/01/14. https://doi.org/10.1109/MEMSYS.2014.6765570

CNT bundles growth on microhotplates for direct measurement of their thermal properties. / Silvestri, C ; Morana, B; Fiorentino, G et al.
Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. ed. / F Ayazi; CJ Kim. Piscataway, NJ, USA: IEEE Society, 2014. p. 48-51.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - CNT bundles growth on microhotplates for direct measurement of their thermal properties

AU - Silvestri, C

AU - Morana, B

AU - Fiorentino, G

AU - Vollebregt, S

AU - Pandraud, G

AU - Santagata, F

AU - Zhang, GQ

AU - Sarro, PM

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/MEMSYS.2014.6765570

DO - 10.1109/MEMSYS.2014.6765570

M3 - Conference contribution

SN - 978-1-4799-3508-6

SP - 48

EP - 51

BT - Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems

A2 - Ayazi, F

A2 - Kim, CJ

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - IEEE MEMS 2014, San Francisco, CA, USA

Y2 - 26 January 2014 through 30 January 2014

ER -

Silvestri C , Morana B, Fiorentino G, Vollebregt S, Pandraud G, Santagata F et al. CNT bundles growth on microhotplates for direct measurement of their thermal properties. In Ayazi F, Kim CJ, editors, Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. Piscataway, NJ, USA: IEEE Society. 2014. p. 48-51 doi: 10.1109/MEMSYS.2014.6765570