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Color shift acceleration on mid-power LED packages. / Lu, Guangjun; Driel, W.D. van; Fan, Xuejun; Fan, Jiajie; Qian, Cheng; Zhang, G.Q.

In: Microelectronics Reliability, Vol. 78, No. Supplement C, 2017, p. 294 - 298.

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Harvard

Lu, G, Driel, WDV, Fan, X, Fan, J, Qian, C & Zhang, GQ 2017, 'Color shift acceleration on mid-power LED packages' Microelectronics Reliability, vol. 78, no. Supplement C, pp. 294 - 298. https://doi.org/10.1016/j.microrel.2017.09.014

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Vancouver

Author

Lu, Guangjun ; Driel, W.D. van ; Fan, Xuejun ; Fan, Jiajie ; Qian, Cheng ; Zhang, G.Q. / Color shift acceleration on mid-power LED packages. In: Microelectronics Reliability. 2017 ; Vol. 78, No. Supplement C. pp. 294 - 298.

BibTeX

@article{2f21b8782a354066a77f57d955cc8e88,
title = "Color shift acceleration on mid-power LED packages",
abstract = "Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages. Temperature stress, humidity stress and current stress were experimentally designed and performed to accelerate the color shift of mid-power LED packages and color shift mechanisms have been discussed based on the color shift results obtained from measurements. Conclusions could be drawn:Linear function fitting demonstrates a good linear relationship between color shift (Δu′ Δv′) and aging time almost for all the aging conditions. We can extrapolate the color shift Δu′ and Δv′ based on the fitted regression equations and then make the prediction for the total color shift Δu′v′.Current stress can induce a different failure mode. Peak intensity reduction analysis reveals that the current stress accelerates the degradation of LED die.Humidity test induced a substantial color shift both in u′ and v′. The u′ has an increased degradation rate after aging of 3000 h at 85{\%}RH & 85 °C, there should be different degradation mechanisms during the whole humidity test. The molecular structure decomposition of silicone plates and then follows the silicone carbonization due to the long-term (3000 h) accumulated high localized temperature aging.",
keywords = "Color shift, Mid-power LED package, Temperature stress, Current stress, Humidity stress",
author = "Guangjun Lu and Driel, {W.D. van} and Xuejun Fan and Jiajie Fan and Cheng Qian and G.Q. Zhang",
year = "2017",
doi = "10.1016/j.microrel.2017.09.014",
language = "English",
volume = "78",
pages = "294 -- 298",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier",
number = "Supplement C",

}

RIS

TY - JOUR

T1 - Color shift acceleration on mid-power LED packages

AU - Lu, Guangjun

AU - Driel, W.D. van

AU - Fan, Xuejun

AU - Fan, Jiajie

AU - Qian, Cheng

AU - Zhang, G.Q.

PY - 2017

Y1 - 2017

N2 - Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages. Temperature stress, humidity stress and current stress were experimentally designed and performed to accelerate the color shift of mid-power LED packages and color shift mechanisms have been discussed based on the color shift results obtained from measurements. Conclusions could be drawn:Linear function fitting demonstrates a good linear relationship between color shift (Δu′ Δv′) and aging time almost for all the aging conditions. We can extrapolate the color shift Δu′ and Δv′ based on the fitted regression equations and then make the prediction for the total color shift Δu′v′.Current stress can induce a different failure mode. Peak intensity reduction analysis reveals that the current stress accelerates the degradation of LED die.Humidity test induced a substantial color shift both in u′ and v′. The u′ has an increased degradation rate after aging of 3000 h at 85%RH & 85 °C, there should be different degradation mechanisms during the whole humidity test. The molecular structure decomposition of silicone plates and then follows the silicone carbonization due to the long-term (3000 h) accumulated high localized temperature aging.

AB - Mid-power LED packages are now widely used in many indoor illumination applications due to several advantages. Temperature stress, humidity stress and current stress were experimentally designed and performed to accelerate the color shift of mid-power LED packages and color shift mechanisms have been discussed based on the color shift results obtained from measurements. Conclusions could be drawn:Linear function fitting demonstrates a good linear relationship between color shift (Δu′ Δv′) and aging time almost for all the aging conditions. We can extrapolate the color shift Δu′ and Δv′ based on the fitted regression equations and then make the prediction for the total color shift Δu′v′.Current stress can induce a different failure mode. Peak intensity reduction analysis reveals that the current stress accelerates the degradation of LED die.Humidity test induced a substantial color shift both in u′ and v′. The u′ has an increased degradation rate after aging of 3000 h at 85%RH & 85 °C, there should be different degradation mechanisms during the whole humidity test. The molecular structure decomposition of silicone plates and then follows the silicone carbonization due to the long-term (3000 h) accumulated high localized temperature aging.

KW - Color shift

KW - Mid-power LED package

KW - Temperature stress

KW - Current stress

KW - Humidity stress

U2 - 10.1016/j.microrel.2017.09.014

DO - 10.1016/j.microrel.2017.09.014

M3 - Article

VL - 78

SP - 294

EP - 298

JO - Microelectronics Reliability

T2 - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - Supplement C

ER -

ID: 32952872