Original language | Undefined/Unknown |
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Title of host publication | Materials Research Society |
Editors | JKR Cheung, K Tsubouchi, M Murakami, N Kobayashi |
Pages | 225-229 |
Number of pages | 5 |
Publication status | Published - 1998 |
Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines
AJ Kalkman, AH Verbruggen, GCAM Janssen, JP Lokker, S Radelaar
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific