The diversified system requirements have been continuously growing to drive the development of a variety of new package styles. Wafer-Level Packaging (WLP) technology has drawn attention with its thinner package due to the removal of substrate and thus higher performance. With the greater design flexibility in having more I/Os, Fan-out Wafer Level Packaging (FOWLP) technology has proven to be a more optimal and promising solution. Infineon's eWLB was introduced as the first generation FOWLP technology. In the eWLB technology, die shift is the processing defect that the die moves from its default position result in the wire disconnection. Placing the dies at the preset pitch can compensate the die shift before die attach process. In this paper, the key factors to controlling die shift will be discussed, and the complex process capability index (Cpk) of process is 2.06 which represents the die shift can be well minimized after compensation.

Original languageEnglish
Title of host publication2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
Subtitle of host publicationProceedings
EditorsT. Ye, F. Xiao, J. Wang, L. Chen
Place of PublicationPiscataway
PublisherIEEE
Pages1681-1686
Number of pages6
ISBN (Electronic)978-1-5386-6386-8
ISBN (Print)978-1-5386-6387-5
DOIs
Publication statusPublished - 2018
EventICEPT 2018: 19th International Conference on Electronic Packaging Technology - Shanghai, China
Duration: 8 Aug 201811 Aug 2018
Conference number: 19

Conference

ConferenceICEPT 2018
CountryChina
CityShanghai
Period8/08/1811/08/18

    Research areas

  • compensation method, die shift, Fan-out wafer level packaging

ID: 47549547