Standard

Cure induced Warpage of micro-electronics: comparison with experiments. / de Vreugd, J; Jansen, KMB; Ernst, LJ; Bohm, C; Falat, TC.

Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. ed. / Ernst, L.J.; Zhang, G.Q.; Driel, W.D. van; Rodgers, P.; Bailey, C.; Saint Leger, O. de. IEEE Society, 2009. p. 374-377.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Harvard

de Vreugd, J, Jansen, KMB, Ernst, LJ, Bohm, C & Falat, TC 2009, Cure induced Warpage of micro-electronics: comparison with experiments. in Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society, pp. 374-377.

APA

de Vreugd, J., Jansen, KMB., Ernst, LJ., Bohm, C., & Falat, TC. (2009). Cure induced Warpage of micro-electronics: comparison with experiments. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., & Saint Leger, O. de (Eds.), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands (pp. 374-377). IEEE Society.

Vancouver

de Vreugd J, Jansen KMB, Ernst LJ, Bohm C, Falat TC. Cure induced Warpage of micro-electronics: comparison with experiments. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de, editors, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society. 2009. p. 374-377

Author

de Vreugd, J ; Jansen, KMB ; Ernst, LJ ; Bohm, C ; Falat, TC. / Cure induced Warpage of micro-electronics: comparison with experiments. Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. editor / Ernst, L.J. ; Zhang, G.Q. ; Driel, W.D. van ; Rodgers, P. ; Bailey, C. ; Saint Leger, O. de. IEEE Society, 2009. pp. 374-377

BibTeX

@inproceedings{1db5f455c714447891b41633156a4aa2,
title = "Cure induced Warpage of micro-electronics: comparison with experiments",
abstract = "Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechancial behavior of molding compound is dependent on time, temperature and degree of conversion. Since molding compound is available in large variabilities, for each type the model parameters should be established experimentally. In our group an efficient method is developed for experimentally determining the model parameters [1, 2, 3]. In this approach, different experimental results have to be combined in order to achieve the final material model. Since this material model is not standard, user-subroutines are used for implementation in finite element software (ABAQUS). In this paper we present validation experiments which are done in order to verify the material model. A TDM (Topography and Deformation Device) is used to measure the curvature of a mold-map at different temperatures. Good agreement between experiment and simulations results is achieved.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{de Vreugd}, J and KMB Jansen and LJ Ernst and C Bohm and TC Falat",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-4159-4",
publisher = "IEEE Society",
pages = "374--377",
editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Bailey, C.} and {Saint Leger, O. de}",
booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands",

}

RIS

TY - GEN

T1 - Cure induced Warpage of micro-electronics: comparison with experiments

AU - de Vreugd, J

AU - Jansen, KMB

AU - Ernst, LJ

AU - Bohm, C

AU - Falat, TC

PY - 2009

Y1 - 2009

N2 - Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechancial behavior of molding compound is dependent on time, temperature and degree of conversion. Since molding compound is available in large variabilities, for each type the model parameters should be established experimentally. In our group an efficient method is developed for experimentally determining the model parameters [1, 2, 3]. In this approach, different experimental results have to be combined in order to achieve the final material model. Since this material model is not standard, user-subroutines are used for implementation in finite element software (ABAQUS). In this paper we present validation experiments which are done in order to verify the material model. A TDM (Topography and Deformation Device) is used to measure the curvature of a mold-map at different temperatures. Good agreement between experiment and simulations results is achieved.

AB - Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechancial behavior of molding compound is dependent on time, temperature and degree of conversion. Since molding compound is available in large variabilities, for each type the model parameters should be established experimentally. In our group an efficient method is developed for experimentally determining the model parameters [1, 2, 3]. In this approach, different experimental results have to be combined in order to achieve the final material model. Since this material model is not standard, user-subroutines are used for implementation in finite element software (ABAQUS). In this paper we present validation experiments which are done in order to verify the material model. A TDM (Topography and Deformation Device) is used to measure the curvature of a mold-map at different temperatures. Good agreement between experiment and simulations results is achieved.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4159-4

SP - 374

EP - 377

BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Driel, W.D. van, null

A2 - Rodgers, P., null

A2 - Bailey, C., null

A2 - Saint Leger, O. de, null

PB - IEEE Society

ER -

ID: 3876856