Deformable silicon electronics using segmentation and ultra-thin substrates

M Bartek; T Zoumpoulidis; L WANG; KMB Jansen; LJ Ernst

Deformable silicon electronics using segmentation and ultra-thin substrates

M Bartek, T Zoumpoulidis, L WANG, KMB Jansen, LJ Ernst

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007)
Editors	s.n.
Place of Publication	Edina
Publisher	Surface Mount Technology Association (smta.org)
Pages	1-6
Number of pages	6
ISBN (Print)	0-9789465-4-5
Publication status	Published - 2007
Event	The 4th International Wafer-Level Packaging Conference (IWLPC 2007) - Edina Duration: 17 Sept 2007 → 19 Sept 2007

Publication series

Name
Publisher	Surface Mount Technology Association (smta.org)

Conference

Conference	The 4th International Wafer-Level Packaging Conference (IWLPC 2007)
Period	17/09/07 → 19/09/07

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{f12aeb3ff73f4230800e2908a0ad9b29,

title = "Deformable silicon electronics using segmentation and ultra-thin substrates",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Bartek and T Zoumpoulidis and L WANG and KMB Jansen and LJ Ernst",

year = "2007",

language = "Undefined/Unknown",

isbn = "0-9789465-4-5",

publisher = "Surface Mount Technology Association (smta.org)",

pages = "1--6",

editor = "s.n.",

booktitle = "Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007)",

note = "The 4th International Wafer-Level Packaging Conference (IWLPC 2007) ; Conference date: 17-09-2007 Through 19-09-2007",

}

Bartek, M, Zoumpoulidis, T, WANG, L, Jansen, KMB & Ernst, LJ 2007, Deformable silicon electronics using segmentation and ultra-thin substrates. in s.n. (ed.), Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). Surface Mount Technology Association (smta.org), Edina, pp. 1-6, The 4th International Wafer-Level Packaging Conference (IWLPC 2007), 17/09/07.

Deformable silicon electronics using segmentation and ultra-thin substrates. / Bartek, M; Zoumpoulidis, T; WANG, L et al.
Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007). ed. / s.n. Edina: Surface Mount Technology Association (smta.org), 2007. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Deformable silicon electronics using segmentation and ultra-thin substrates

AU - Bartek, M

AU - Zoumpoulidis, T

AU - WANG, L

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-9789465-4-5

SP - 1

EP - 6

BT - Proceedings of the 4th International Wafer-Level Packaging Conference (IWLPC 2007)

A2 - s.n., null

PB - Surface Mount Technology Association (smta.org)

CY - Edina

T2 - The 4th International Wafer-Level Packaging Conference (IWLPC 2007)

Y2 - 17 September 2007 through 19 September 2007

ER -