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Delamination and combined compound cracking of EMC-copper interfaces. / Xiao, A; Schlottig, G; Pape, H; Wunderle, B; Jansen, KMB; Ernst, LJ.

Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. ed. / n.a. Las Vegas, NV, USA : IEEE Society, 2010. p. 114-120.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Xiao, A, Schlottig, G, Pape, H, Wunderle, B, Jansen, KMB & Ernst, LJ 2010, Delamination and combined compound cracking of EMC-copper interfaces. in n.a. (ed.), Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. IEEE Society, Las Vegas, NV, USA, pp. 114-120, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 1/06/10.

APA

Xiao, A., Schlottig, G., Pape, H., Wunderle, B., Jansen, KMB., & Ernst, LJ. (2010). Delamination and combined compound cracking of EMC-copper interfaces. In n.a. (Ed.), Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA (pp. 114-120). Las Vegas, NV, USA: IEEE Society.

Vancouver

Xiao A, Schlottig G, Pape H, Wunderle B, Jansen KMB, Ernst LJ. Delamination and combined compound cracking of EMC-copper interfaces. In n.a., editor, Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. Las Vegas, NV, USA: IEEE Society. 2010. p. 114-120

Author

Xiao, A ; Schlottig, G ; Pape, H ; Wunderle, B ; Jansen, KMB ; Ernst, LJ. / Delamination and combined compound cracking of EMC-copper interfaces. Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA. editor / n.a. Las Vegas, NV, USA : IEEE Society, 2010. pp. 114-120

BibTeX

@inproceedings{1fd9a19a5ba0467e9577590ea57ca779,
title = "Delamination and combined compound cracking of EMC-copper interfaces",
abstract = "The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1-2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "A Xiao and G Schlottig and H Pape and B Wunderle and KMB Jansen and LJ Ernst",
year = "2010",
language = "English",
isbn = "978-1-4244-6411-1",
publisher = "IEEE Society",
pages = "114--120",
editor = "n.a.",
booktitle = "Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA",

}

RIS

TY - GEN

T1 - Delamination and combined compound cracking of EMC-copper interfaces

AU - Xiao, A

AU - Schlottig, G

AU - Pape, H

AU - Wunderle, B

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2010

Y1 - 2010

N2 - The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1-2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.

AB - The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1-2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-6411-1

SP - 114

EP - 120

BT - Proceedings of the 60th Electronic Components and Technology Conference (ECTC), 1-4 June 2010, Las Vegas, NV, USA

A2 - n.a., null

PB - IEEE Society

CY - Las Vegas, NV, USA

ER -

ID: 3215857