Determination of visco-elastic properties during the curing process of underfill materials

LJ Ernst, ? et al

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 50th electronic components & technology conference, May 21-24
Place of Publication	Piscataway, NJ
Publisher	IEEE Society
Pages	1070-1077
Number of pages	8
ISBN (Print)	0-7803-5909-7
Publication status	Published - 2000
Event	Las Vegas - Piscataway, NJ Duration: 21 May 2000 → 24 May 2000

Name
Publisher	IEEE

Conference	Las Vegas
Period	21/05/00 → 24/05/00

Keywords

@inproceedings{8cdfa9c734c64ef986d7174d21e27fb0,

title = "Determination of visco-elastic properties during the curing process of underfill materials",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "LJ Ernst and {et al}, ?",

year = "2000",

language = "Undefined/Unknown",

isbn = "0-7803-5909-7",

publisher = "IEEE Society",

pages = "1070--1077",

booktitle = "Proceedings of the 50th electronic components & technology conference, May 21-24",

note = "Las Vegas ; Conference date: 21-05-2000 Through 24-05-2000",

}

TY - GEN

T1 - Determination of visco-elastic properties during the curing process of underfill materials

AU - Ernst, LJ

AU - et al, ?

PY - 2000

Y1 - 2000

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-5909-7

SP - 1070

EP - 1077

BT - Proceedings of the 50th electronic components & technology conference, May 21-24

PB - IEEE Society

CY - Piscataway, NJ

T2 - Las Vegas

Y2 - 21 May 2000 through 24 May 2000

ER -