Driving mechanisms of delamination related reliability problems in exposed pad packages

WD van Driel; HJL Bressers; JHJ Janssen; JA Bielen; X Yan; MAJ van Gils; PMP Stevens; PJJHA Habets; GQ Zhang; LJ Ernst

Driving mechanisms of delamination related reliability problems in exposed pad packages

WD van Driel, HJL Bressers, JHJ Janssen, JA Bielen, X Yan, MAJ van Gils, PMP Stevens, PJJHA Habets, GQ Zhang, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

14 Citations (Scopus)

Original language	English
Title of host publication	Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005
Editors	Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S, Saint Leger, O de
Publisher	IEEE Society
Pages	183-189
Number of pages	7
ISBN (Print)	0-7803-9062-8
Publication status	Published - 2005
Event	EuroSimE 2005: 6th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Berlin, Germany Duration: 17 Apr 2005 → 20 Apr 2005 Conference number: 6

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2005
Country/Territory	Germany
City	Berlin
Period	17/04/05 → 20/04/05

Bibliographical note

Nog niet eerder opgevoerd

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

van Driel, WD., Bressers, HJL., Janssen, JHJ., Bielen, JA., Yan, X., van Gils, MAJ., Stevens, PMP., Habets, PJJHA., Zhang, GQ., & Ernst, LJ. (2005). Driving mechanisms of delamination related reliability problems in exposed pad packages. In Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S, & Saint Leger, O de (Eds.), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005 (pp. 183-189). IEEE Society.

van Driel, WD ; Bressers, HJL ; Janssen, JHJ et al. / Driving mechanisms of delamination related reliability problems in exposed pad packages. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. editor / Ernst, LJ ; Zhang, GQ ; Rodgers, P ; Meuwissen, M ; Marco, S ; Saint Leger, O de. IEEE Society, 2005. pp. 183-189

@inproceedings{18473fdc4d8a434e937f826570e06fdf,

title = "Driving mechanisms of delamination related reliability problems in exposed pad packages",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{van Driel}, WD and HJL Bressers and JHJ Janssen and JA Bielen and X Yan and {van Gils}, MAJ and PMP Stevens and PJJHA Habets and GQ Zhang and LJ Ernst",

note = "Nog niet eerder opgevoerd; EuroSimE 2005 : 6th Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Conference date: 17-04-2005 Through 20-04-2005",

year = "2005",

language = "English",

isbn = "0-7803-9062-8",

publisher = "IEEE Society",

pages = "183--189",

editor = "{Ernst, LJ} and {Zhang, GQ} and {Rodgers, P} and {Meuwissen, M} and {Marco, S} and {Saint Leger, O de}",

booktitle = "Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005",

}

van Driel, WD, Bressers, HJL, Janssen, JHJ, Bielen, JA, Yan, X, van Gils, MAJ, Stevens, PMP, Habets, PJJHA, Zhang, GQ & Ernst, LJ 2005, Driving mechanisms of delamination related reliability problems in exposed pad packages. in Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S & Saint Leger, O de (eds), Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. IEEE Society, pp. 183-189, EuroSimE 2005, Berlin, Germany, 17/04/05.

Driving mechanisms of delamination related reliability problems in exposed pad packages. / van Driel, WD; Bressers, HJL; Janssen, JHJ et al.
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. ed. / Ernst, LJ; Zhang, GQ; Rodgers, P; Meuwissen, M; Marco, S; Saint Leger, O de. IEEE Society, 2005. p. 183-189.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Driving mechanisms of delamination related reliability problems in exposed pad packages

AU - van Driel, WD

AU - Bressers, HJL

AU - Janssen, JHJ

AU - Bielen, JA

AU - Yan, X

AU - van Gils, MAJ

AU - Stevens, PMP

AU - Habets, PJJHA

AU - Zhang, GQ

AU - Ernst, LJ

N1 - Conference code: 6

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9062-8

SP - 183

EP - 189

BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005

A2 - Ernst, LJ, null

A2 - Zhang, GQ, null

A2 - Rodgers, P, null

A2 - Meuwissen, M, null

A2 - Marco, S, null

A2 - Saint Leger, O de, null

PB - IEEE Society

T2 - EuroSimE 2005

Y2 - 17 April 2005 through 20 April 2005

ER -

van Driel WD, Bressers HJL, Janssen JHJ, Bielen JA, Yan X, van Gils MAJ et al. Driving mechanisms of delamination related reliability problems in exposed pad packages. In Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S, Saint Leger, O de, editors, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. IEEE Society. 2005. p. 183-189