Standard

Effect of Postcure and Thermal Aging on Molding Compound Properties. / de Vreugd, J; Sanchez Monforte, A; Jansen, KMB; Ernst, LJ; Bohm, C; Kessler, A; Preu, H.

Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. ed. / s.n. Singapore : IEEE Society, 2009. p. 342-347.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

Harvard

de Vreugd, J, Sanchez Monforte, A, Jansen, KMB, Ernst, LJ, Bohm, C, Kessler, A & Preu, H 2009, Effect of Postcure and Thermal Aging on Molding Compound Properties. in s.n. (ed.), Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. IEEE Society, Singapore, pp. 342-347, 11th Electronics Packaging Technology Conference, EPTC 2009, Singapore, 9/12/09.

APA

de Vreugd, J., Sanchez Monforte, A., Jansen, KMB., Ernst, LJ., Bohm, C., Kessler, A., & Preu, H. (2009). Effect of Postcure and Thermal Aging on Molding Compound Properties. In s.n. (Ed.), Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore (pp. 342-347). Singapore: IEEE Society.

Vancouver

de Vreugd J, Sanchez Monforte A, Jansen KMB, Ernst LJ, Bohm C, Kessler A et al. Effect of Postcure and Thermal Aging on Molding Compound Properties. In s.n., editor, Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. Singapore: IEEE Society. 2009. p. 342-347

Author

de Vreugd, J ; Sanchez Monforte, A ; Jansen, KMB ; Ernst, LJ ; Bohm, C ; Kessler, A ; Preu, H. / Effect of Postcure and Thermal Aging on Molding Compound Properties. Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore. editor / s.n. Singapore : IEEE Society, 2009. pp. 342-347

BibTeX

@inproceedings{6992f5bc13974e1f8c0c3c2add59ae82,
title = "Effect of Postcure and Thermal Aging on Molding Compound Properties",
abstract = "Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on the thermomechanical properties of molding compound is scarcely studied. Some studies are devoted to this topic but are not systematically carried out. The main conclusion of previous research is that the glass-transition temperature increases at increasing postcure time [1]. Also weight loss during aging is reported [2]. Since thermomechanical properties determine mainly the reliability of electronic devices it is essential to have knowledge of the effect of post mold cure treatment and thermal aging. In this research the influence of postcure and thermal aging is studied in a systematic way. It turns out that postcure and thermal aging treatment causes an increase in Tg, a change in viscoelastic behavior, an increase of the rubbery modulus, and ongoing shrinkage of the molding compound. The change of these properties is attributed to the oxidation of the molding compound at high temperatures.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "{de Vreugd}, J and {Sanchez Monforte}, A and KMB Jansen and LJ Ernst and C Bohm and A Kessler and H Preu",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-5100-5",
publisher = "IEEE Society",
pages = "342--347",
editor = "s.n.",
booktitle = "Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore",

}

RIS

TY - GEN

T1 - Effect of Postcure and Thermal Aging on Molding Compound Properties

AU - de Vreugd, J

AU - Sanchez Monforte, A

AU - Jansen, KMB

AU - Ernst, LJ

AU - Bohm, C

AU - Kessler, A

AU - Preu, H

PY - 2009

Y1 - 2009

N2 - Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on the thermomechanical properties of molding compound is scarcely studied. Some studies are devoted to this topic but are not systematically carried out. The main conclusion of previous research is that the glass-transition temperature increases at increasing postcure time [1]. Also weight loss during aging is reported [2]. Since thermomechanical properties determine mainly the reliability of electronic devices it is essential to have knowledge of the effect of post mold cure treatment and thermal aging. In this research the influence of postcure and thermal aging is studied in a systematic way. It turns out that postcure and thermal aging treatment causes an increase in Tg, a change in viscoelastic behavior, an increase of the rubbery modulus, and ongoing shrinkage of the molding compound. The change of these properties is attributed to the oxidation of the molding compound at high temperatures.

AB - Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on the thermomechanical properties of molding compound is scarcely studied. Some studies are devoted to this topic but are not systematically carried out. The main conclusion of previous research is that the glass-transition temperature increases at increasing postcure time [1]. Also weight loss during aging is reported [2]. Since thermomechanical properties determine mainly the reliability of electronic devices it is essential to have knowledge of the effect of post mold cure treatment and thermal aging. In this research the influence of postcure and thermal aging is studied in a systematic way. It turns out that postcure and thermal aging treatment causes an increase in Tg, a change in viscoelastic behavior, an increase of the rubbery modulus, and ongoing shrinkage of the molding compound. The change of these properties is attributed to the oxidation of the molding compound at high temperatures.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-5100-5

SP - 342

EP - 347

BT - Proceedings of the 11th Electronics Packaging Technology Conference, EPTC 2009, 9-11 December 2009, Singapore

A2 - s.n., null

PB - IEEE Society

CY - Singapore

ER -

ID: 2081690