Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants

Kambiz Nanbakhsh, Marta Kluba, Barbara Pahl, Florian Bourgeois, Ronald Dekker, Wouter Serdijn, Vasiliki Giagka

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

10 Citations (Scopus)
122 Downloads (Pure)

Abstract

Platinum is widely used as the electrode material for implantable devices. Owing to its high biostability and corrosion resistivity, platinum could also be used as the main metallization for tracks in active implants. Towards this goal, in this work we investigate the stability of parylene-coated Pt tracks using passive and active tests. The test samples in this study are Pt-on-SiO 2 interdigitated comb structures. During testing all samples were immersed in saline for 150 days; for passive testing, the samples were left unbiased, whilst for active testing, samples were exposed to two different stress signals: a 5 V DC and a 5 Vp 500 pulses per second biphasic signal. All samples were monitored over time using impedance spectroscopy combined with optical inspection. After the first two weeks of immersion, delamination spots were observed on the Pt tracks for both passive and actively tested samples. Despite the delamination spots, the unbiased samples maintained high impedances until the end of the study. For the actively stressed samples, two different failure mechanisms were observed which were signal related. DC stressed samples showed severe parylene cracking mainly due to the electrolysis of the condensed water. Biphasically stressed samples showed gradual Pt dissolution and migration. These results contribute to a better understanding of the failure mechanisms of Pt tracks in active implants and suggest that new testing paradigms may be necessary to fully assess the long-term reliability of these devices.
Original languageEnglish
Title of host publication2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2019
Place of PublicationDanvers
PublisherIEEE
Pages3840-3844
Number of pages5
ISBN (Electronic)978-1-5386-1311-5
ISBN (Print)978-1-5386-1312-2
DOIs
Publication statusPublished - 26 Jul 2019
EventEMBC 2019: 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society - Berlin, Germany
Duration: 23 Jul 201927 Jul 2019
Conference number: 41st

Publication series

NameProceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
ISSN (Print)1557-170X

Conference

ConferenceEMBC 2019
Country/TerritoryGermany
CityBerlin
Period23/07/1927/07/19

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