Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS

F Sebastiano; S Drago; L Breems; D Leenaerts; B Nauta; KAA Makinwa

doi:10.1109/ESSCIRC.2011.6044394

Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS

F Sebastiano, S Drago, L Breems, D Leenaerts, B Nauta, KAA Makinwa

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

5 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 2011 European Solid-State Circuits Conference
Editors	H Tenhunen, M Aberg
Place of Publication	Piscataway,NJ, USA
Publisher	IEEE Society
Pages	511-514
Number of pages	4
ISBN (Print)	978-1-4577-0704-9
DOIs	https://doi.org/10.1109/ESSCIRC.2011.6044394
Publication status	Published - 2011
Event	ESSCIRC 2011: 37th European Solid-State Circuits Conference - Finlandia Hall, Helsinki, Finland Duration: 12 Sept 2011 → 16 Sept 2011 Conference number: 37

Publication series

Name
Publisher	IEEE

Conference

Conference	ESSCIRC 2011
Abbreviated title	ESSCIRC
Country/Territory	Finland
City	Helsinki
Period	12/09/11 → 16/09/11

Access to Document

10.1109/ESSCIRC.2011.6044394

Cite this

@inproceedings{e64fbad713314138bcf5f17bf34c2f47,

title = "Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS",

author = "F Sebastiano and S Drago and L Breems and D Leenaerts and B Nauta and KAA Makinwa",

year = "2011",

doi = "10.1109/ESSCIRC.2011.6044394",

language = "English",

isbn = "978-1-4577-0704-9",

publisher = "IEEE Society",

pages = "511--514",

editor = "H Tenhunen and M Aberg",

booktitle = "Proceedings 2011 European Solid-State Circuits Conference",

note = "ESSCIRC 2011 : 37th European Solid-State Circuits Conference, ESSCIRC ; Conference date: 12-09-2011 Through 16-09-2011",

}

Sebastiano, F, Drago, S, Breems, L, Leenaerts, D, Nauta, B & Makinwa, KAA 2011, Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS. in H Tenhunen & M Aberg (eds), Proceedings 2011 European Solid-State Circuits Conference. IEEE Society, Piscataway,NJ, USA, pp. 511-514, ESSCIRC 2011, Helsinki, Finland, 12/09/11. https://doi.org/10.1109/ESSCIRC.2011.6044394

Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS. / Sebastiano, F; Drago, S; Breems, L et al.
Proceedings 2011 European Solid-State Circuits Conference. ed. / H Tenhunen; M Aberg. Piscataway,NJ, USA: IEEE Society, 2011. p. 511-514.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Effects of packaging and process spread on a mobility-based frequency reference in 0.16-¿m CMOS

AU - Sebastiano, F

AU - Drago, S

AU - Breems, L

AU - Leenaerts, D

AU - Nauta, B

AU - Makinwa, KAA

N1 - Conference code: 37

PY - 2011

Y1 - 2011

U2 - 10.1109/ESSCIRC.2011.6044394

DO - 10.1109/ESSCIRC.2011.6044394

M3 - Conference contribution

SN - 978-1-4577-0704-9

SP - 511

EP - 514

BT - Proceedings 2011 European Solid-State Circuits Conference

A2 - Tenhunen, H

A2 - Aberg, M

PB - IEEE Society

CY - Piscataway,NJ, USA

T2 - ESSCIRC 2011

Y2 - 12 September 2011 through 16 September 2011

ER -