Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

YT He; F Li; WF He; J Hui; GQ Zhang; LJ Ernst

Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

YT He, F Li, WF He, J Hui, GQ Zhang, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology)
Editors	YS Luo, Q Rao, Y Xu
Place of Publication	New York
Publisher	Science Press USA inc
Pages	900-903
Number of pages	4
Publication status	Published - 2005
Event	4th Pacific Rim Conference on Rheology, Shanghai, China - New York Duration: 7 Aug 2005 → 11 Aug 2005

Publication series

Name
Publisher	Science Press USA Inc.

Conference

Conference	4th Pacific Rim Conference on Rheology, Shanghai, China
Period	7/08/05 → 11/08/05

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{bc029d4c9d7e4949b9d2e27c8f2d35af,

title = "Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages",

keywords = "Conf.proc. > 3 pag",

author = "YT He and F Li and WF He and J Hui and GQ Zhang and LJ Ernst",

year = "2005",

language = "Undefined/Unknown",

publisher = "Science Press USA inc",

pages = "900--903",

editor = "YS Luo and Q Rao and Y Xu",

booktitle = "Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology)",

note = "4th Pacific Rim Conference on Rheology, Shanghai, China ; Conference date: 07-08-2005 Through 11-08-2005",

}

He, YT, Li, F, He, WF, Hui, J, Zhang, GQ & Ernst, LJ 2005, Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages. in YS Luo, Q Rao & Y Xu (eds), Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology). Science Press USA inc, New York, pp. 900-903, 4th Pacific Rim Conference on Rheology, Shanghai, China, 7/08/05.

Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages. / He, YT; Li, F; He, WF et al.
Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology). ed. / YS Luo; Q Rao; Y Xu. New York: Science Press USA inc, 2005. p. 900-903.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Effects of rheology of compound materials on passivation cracking of micro-structure of ic packages

AU - He, YT

AU - Li, F

AU - He, WF

AU - Hui, J

AU - Zhang, GQ

AU - Ernst, LJ

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 900

EP - 903

BT - Advances in Rheology and its Applications (Proceedings of 4th Pacific Rim Conference on Rheology)

A2 - Luo, YS

A2 - Rao, Q

A2 - Xu, Y

PB - Science Press USA inc

CY - New York

T2 - 4th Pacific Rim Conference on Rheology, Shanghai, China

Y2 - 7 August 2005 through 11 August 2005

ER -