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Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages. / Jiang, Chengshuo; Fan, Jiajie; Qian, Cheng; Zhang, Hao; Fan, Xuejun; Guo, Weiling; Zhang, Guoqi.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 7, 2018, p. 1254-1262.

Research output: Contribution to journalArticleScientificpeer-review

Harvard

Jiang, C, Fan, J, Qian, C, Zhang, H, Fan, X, Guo, W & Zhang, G 2018, 'Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages' IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 7, pp. 1254-1262. https://doi.org/10.1109/TCPMT.2018.2789345

APA

Jiang, C., Fan, J., Qian, C., Zhang, H., Fan, X., Guo, W., & Zhang, G. (2018). Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages. IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(7), 1254-1262. https://doi.org/10.1109/TCPMT.2018.2789345

Vancouver

Jiang C, Fan J, Qian C, Zhang H, Fan X, Guo W et al. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2018;8(7):1254-1262. https://doi.org/10.1109/TCPMT.2018.2789345

Author

Jiang, Chengshuo ; Fan, Jiajie ; Qian, Cheng ; Zhang, Hao ; Fan, Xuejun ; Guo, Weiling ; Zhang, Guoqi. / Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages. In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 2018 ; Vol. 8, No. 7. pp. 1254-1262.

BibTeX

@article{0d58cb0cdec441e0bec5423795de3fed,
title = "Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages",
abstract = "High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on solderability and mechanical properties for the interconnection of high-power LED CSPs. However, reliability problems caused by voids in the SAC305 solder limit its wide application in the high-power LED chip-scale packaging process. Existence of the voids has been considered as one of the major issues causing chip-on-substrate level reliability problems in microelectronic and optoelectronic devices. In this paper, mechanical and thermal properties of SAC305 solder layers with arbitrary voids used in high-power LED CSPs are studied with both finite-element simulations and experiments. The results show that void size and void position within the solder layer are the two most critical issues on the shear strength of interconnection and the chip-on-substrate level thermal distribution in high-power LED CSPs.",
keywords = "Chip-scale package (CSP), flip-chip die attach, high-power light-emitting diode (LED), Light emitting diodes, Mechanical factors, Microassembly, Reliability, reliability, Substrates, Thermal resistance, voids.",
author = "Chengshuo Jiang and Jiajie Fan and Cheng Qian and Hao Zhang and Xuejun Fan and Weiling Guo and Guoqi Zhang",
year = "2018",
doi = "10.1109/TCPMT.2018.2789345",
language = "English",
volume = "8",
pages = "1254--1262",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
number = "7",

}

RIS

TY - JOUR

T1 - Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

AU - Jiang, Chengshuo

AU - Fan, Jiajie

AU - Qian, Cheng

AU - Zhang, Hao

AU - Fan, Xuejun

AU - Guo, Weiling

AU - Zhang, Guoqi

PY - 2018

Y1 - 2018

N2 - High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on solderability and mechanical properties for the interconnection of high-power LED CSPs. However, reliability problems caused by voids in the SAC305 solder limit its wide application in the high-power LED chip-scale packaging process. Existence of the voids has been considered as one of the major issues causing chip-on-substrate level reliability problems in microelectronic and optoelectronic devices. In this paper, mechanical and thermal properties of SAC305 solder layers with arbitrary voids used in high-power LED CSPs are studied with both finite-element simulations and experiments. The results show that void size and void position within the solder layer are the two most critical issues on the shear strength of interconnection and the chip-on-substrate level thermal distribution in high-power LED CSPs.

AB - High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on solderability and mechanical properties for the interconnection of high-power LED CSPs. However, reliability problems caused by voids in the SAC305 solder limit its wide application in the high-power LED chip-scale packaging process. Existence of the voids has been considered as one of the major issues causing chip-on-substrate level reliability problems in microelectronic and optoelectronic devices. In this paper, mechanical and thermal properties of SAC305 solder layers with arbitrary voids used in high-power LED CSPs are studied with both finite-element simulations and experiments. The results show that void size and void position within the solder layer are the two most critical issues on the shear strength of interconnection and the chip-on-substrate level thermal distribution in high-power LED CSPs.

KW - Chip-scale package (CSP)

KW - flip-chip die attach

KW - high-power light-emitting diode (LED)

KW - Light emitting diodes

KW - Mechanical factors

KW - Microassembly

KW - Reliability

KW - reliability

KW - Substrates

KW - Thermal resistance

KW - voids.

UR - http://www.scopus.com/inward/record.url?scp=85041378157&partnerID=8YFLogxK

U2 - 10.1109/TCPMT.2018.2789345

DO - 10.1109/TCPMT.2018.2789345

M3 - Article

VL - 8

SP - 1254

EP - 1262

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

T2 - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

SN - 1521-3323

IS - 7

ER -

ID: 44903959