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Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications. / Venkatesh, M.; Mansouri, B. El; Wei, J.; Bossche, A.; Zhang, G.Q.

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2016. p. 1-9.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Venkatesh, M, Mansouri, BE, Wei, J, Bossche, A & Zhang, GQ 2016, Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications. in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp. 1-9, EuroSimE 2016, Montpellier, France, 17/04/16. https://doi.org/10.1109/eurosime.2016.7463385

APA

Venkatesh, M., Mansouri, B. E., Wei, J., Bossche, A., & Zhang, G. Q. (2016). Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-9). IEEE. https://doi.org/10.1109/eurosime.2016.7463385

Vancouver

Venkatesh M, Mansouri BE, Wei J, Bossche A, Zhang GQ. Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE. 2016. p. 1-9 https://doi.org/10.1109/eurosime.2016.7463385

Author

Venkatesh, M. ; Mansouri, B. El ; Wei, J. ; Bossche, A. ; Zhang, G.Q. / Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications. 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2016. pp. 1-9

BibTeX

@inproceedings{a852f134eb0e4512bfa9c4f308c1a5e1,
title = "Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications",
abstract = "In this paper, we present electro-thermal analysis and design of a combined MEMS micro hotplate and interdigitated-capacitance impedance sensor for gas sensing application using nano-porous materials like metal organic framework (MOF). The effects of design parameters of interdigitated electrodes such as width(W) and gap(G) of the capacitor, metallization ratio, number of electrodes and area of the capacitor. The influence of height of the electrode material, thickness of the insulation layer between the capacitance electrodes and the micro hotplate electrodes are studied. These design parameters are optimized to obtain a high bare capacitance of the electrodes using analytical and electric and thermal domain simulations in COMSOL 5. The design and thermal analysis of the micro hotplate for a temperature range of (150-300°C) and low power consumption is modelled and results are discussed.",
keywords = "Electrodes, Capacitance, Heating, Analytical models, Sensors, Micromechanical devices, Capacitors",
author = "M. Venkatesh and Mansouri, {B. El} and J. Wei and A. Bossche and G.Q. Zhang",
year = "2016",
month = "5",
day = "5",
doi = "10.1109/eurosime.2016.7463385",
language = "English",
pages = "1--9",
booktitle = "2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",
publisher = "IEEE",
address = "United States",

}

RIS

TY - GEN

T1 - Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications

AU - Venkatesh, M.

AU - Mansouri, B. El

AU - Wei, J.

AU - Bossche, A.

AU - Zhang, G.Q.

PY - 2016/5/5

Y1 - 2016/5/5

N2 - In this paper, we present electro-thermal analysis and design of a combined MEMS micro hotplate and interdigitated-capacitance impedance sensor for gas sensing application using nano-porous materials like metal organic framework (MOF). The effects of design parameters of interdigitated electrodes such as width(W) and gap(G) of the capacitor, metallization ratio, number of electrodes and area of the capacitor. The influence of height of the electrode material, thickness of the insulation layer between the capacitance electrodes and the micro hotplate electrodes are studied. These design parameters are optimized to obtain a high bare capacitance of the electrodes using analytical and electric and thermal domain simulations in COMSOL 5. The design and thermal analysis of the micro hotplate for a temperature range of (150-300°C) and low power consumption is modelled and results are discussed.

AB - In this paper, we present electro-thermal analysis and design of a combined MEMS micro hotplate and interdigitated-capacitance impedance sensor for gas sensing application using nano-porous materials like metal organic framework (MOF). The effects of design parameters of interdigitated electrodes such as width(W) and gap(G) of the capacitor, metallization ratio, number of electrodes and area of the capacitor. The influence of height of the electrode material, thickness of the insulation layer between the capacitance electrodes and the micro hotplate electrodes are studied. These design parameters are optimized to obtain a high bare capacitance of the electrodes using analytical and electric and thermal domain simulations in COMSOL 5. The design and thermal analysis of the micro hotplate for a temperature range of (150-300°C) and low power consumption is modelled and results are discussed.

KW - Electrodes

KW - Capacitance

KW - Heating

KW - Analytical models

KW - Sensors

KW - Micromechanical devices

KW - Capacitors

U2 - 10.1109/eurosime.2016.7463385

DO - 10.1109/eurosime.2016.7463385

M3 - Conference contribution

SP - 1

EP - 9

BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - IEEE

ER -

ID: 11340200