• A Xiao
  • J de Vreugd
  • H Pape
  • B Wunderle
  • KMB Jansen
  • LJ Ernst
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA
Editors Bonda, R., Dias, R.
Place of PublicationSan Diego, CA, USA
PublisherIEEE Society
Pages239-245
Number of pages7
ISBN (Print)978-1-4244-4476-2
Publication statusPublished - 2009
Event2009 IEEE 59th Electronic Components and Technology Conference, San Diego, CA, USA - San Diego, CA, USA
Duration: 26 May 200929 May 2009

Publication series

Name
PublisherIEEE

Conference

Conference2009 IEEE 59th Electronic Components and Technology Conference, San Diego, CA, USA
Period26/05/0929/05/09

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3782896