Standard

Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region. / Xiao, A; de Vreugd, J; Pape, H; Wunderle, B; Jansen, KMB; Ernst, LJ.

Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. ed. / Bonda, R.; Dias, R. San Diego, CA, USA : IEEE Society, 2009. p. 239-245.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Harvard

Xiao, A, de Vreugd, J, Pape, H, Wunderle, B, Jansen, KMB & Ernst, LJ 2009, Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region. in Bonda, R. & Dias, R. (eds), Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. IEEE Society, San Diego, CA, USA, pp. 239-245, 2009 IEEE 59th Electronic Components and Technology Conference, San Diego, CA, USA, 26/05/09.

APA

Xiao, A., de Vreugd, J., Pape, H., Wunderle, B., Jansen, KMB., & Ernst, LJ. (2009). Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region. In Bonda, R., & Dias, R. (Eds.), Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA (pp. 239-245). San Diego, CA, USA: IEEE Society.

Vancouver

Xiao A, de Vreugd J, Pape H, Wunderle B, Jansen KMB, Ernst LJ. Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region. In Bonda, R., Dias, R., editors, Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. San Diego, CA, USA: IEEE Society. 2009. p. 239-245

Author

Xiao, A ; de Vreugd, J ; Pape, H ; Wunderle, B ; Jansen, KMB ; Ernst, LJ. / Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region. Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA. editor / Bonda, R. ; Dias, R. San Diego, CA, USA : IEEE Society, 2009. pp. 239-245

BibTeX

@inproceedings{f979c4f087a34b828579cfda7e252dbe,
title = "Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region",
abstract = "An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "A Xiao and {de Vreugd}, J and H Pape and B Wunderle and KMB Jansen and LJ Ernst",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-4476-2",
publisher = "IEEE Society",
pages = "239--245",
editor = "{Bonda, R.} and {Dias, R.}",
booktitle = "Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA",

}

RIS

TY - GEN

T1 - Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region

AU - Xiao, A

AU - de Vreugd, J

AU - Pape, H

AU - Wunderle, B

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2009

Y1 - 2009

N2 - An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.

AB - An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4476-2

SP - 239

EP - 245

BT - Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA

A2 - Bonda, R., null

A2 - Dias, R., null

PB - IEEE Society

CY - San Diego, CA, USA

ER -

ID: 3782896