@inproceedings{f979c4f087a34b828579cfda7e252dbe,
title = "Establishing Fracture Properties of EMC-Copper Interfaces in the Visco-Elastic Temperature Region",
abstract = "An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "A Xiao and {de Vreugd}, J and H Pape and B Wunderle and KMB Jansen and LJ Ernst",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-4476-2",
publisher = "IEEE Society",
pages = "239--245",
editor = "{Bonda, R.} and {Dias, R.}",
booktitle = "Proceedings of the 2009 IEEE 59th Electronic Components and Technology Conference, 26-29 May 2009, San Diego, CA, USA",
note = "2009 IEEE 59th Electronic Components and Technology Conference, San Diego, CA, USA ; Conference date: 26-05-2009 Through 29-05-2009",
}