• LJ Ernst
  • A Xiao
  • J de Vreugd
  • KMB Jansen
  • H Pape
  • G Schlottig
  • B Wunderle
Interfacial delamination has become one of the key reliability issues in the microelectronics of portable devices and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the delamination propagates under mixed mode conditions. In this study, a modified mixed mode bending test using production line interface samples is proposed. The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling. The interface types being considered in the present work are between EMC's and copper lead frame. Keywords-fracture; delamination; testing
Original languageEnglish
Title of host publicationProceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska
Editors n.a.
Place of PublicationAnchorage, Alaska
PublisherIEEE Society
Pages1-6
Number of pages6
ISBN (Print)978-1-4244-2515-0
Publication statusPublished - 2009
Event2009 IEEE 70th Vehicular Technology Conference Fall, Anchorage, Alaska - Anchorage, Alaska
Duration: 20 Sep 200923 Sep 2009

Publication series

Name
PublisherIEEE

Conference

Conference2009 IEEE 70th Vehicular Technology Conference Fall, Anchorage, Alaska
Period20/09/0923/09/09

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 2643492