@inproceedings{7b1a4d21d6034e0cb9678bc5ddbd6eaa,
title = "Establishing fracture properties of EMC-copper (-oxide) interfaces",
abstract = "Interfacial delamination has become one of the key reliability issues in the microelectronics of portable devices and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the delamination propagates under mixed mode conditions. In this study, a modified mixed mode bending test using production line interface samples is proposed. The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling. The interface types being considered in the present work are between EMC's and copper lead frame. Keywords-fracture; delamination; testing",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "LJ Ernst and A Xiao and {de Vreugd}, J and KMB Jansen and H Pape and G Schlottig and B Wunderle",
note = "Nog niet eerder opgevoerd; 2009 IEEE 70th Vehicular Technology Conference Fall, Anchorage, Alaska ; Conference date: 20-09-2009 Through 23-09-2009",
year = "2009",
language = "English",
isbn = "978-1-4244-2515-0",
publisher = "IEEE Society",
pages = "1--6",
editor = "n.a.",
booktitle = "Proceedings of the 2009 IEEE 70th Vehicular Technology Conference Fall, 20-23 September 2009, Anchorage, Alaska",
}