Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

M Sadeghinia; KMB Jansen; LJ Ernst; H Pape

Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

M Sadeghinia, KMB Jansen, LJ Ernst, H Pape

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012
Place of Publication	s.l.
Publisher	IEEE Society
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4673-1513-5
Publication status	Published - 2012
Event	EuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal Duration: 16 Apr 2012 → 18 Apr 2012 Conference number: 13

Conference

Conference	EuroSimE 2012
Country/Territory	Portugal
City	Lisbon
Period	16/04/12 → 18/04/12

Keywords

Conf.proc. > 3 pag

Cite this

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title = "Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition",

keywords = "Conf.proc. > 3 pag",

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booktitle = "Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012",

publisher = "IEEE Society",

note = "EuroSimE 2012 : 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 16-04-2012 Through 18-04-2012",

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Sadeghinia, M, Jansen, KMB, Ernst, LJ & Pape, H 2012, Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. in Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. IEEE Society, s.l., pp. 1-4, EuroSimE 2012, Lisbon, Portugal, 16/04/12.

Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. / Sadeghinia, M; Jansen, KMB; Ernst, LJ et al.
Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society, 2012. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

AU - Pape, H

N1 - Conference code: 13

PY - 2012

Y1 - 2012

KW - Conf.proc. > 3 pag

UR - http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=6191739&contentType=Conference+Publications

M3 - Conference contribution

SN - 978-1-4673-1513-5

SP - 1

EP - 4

BT - Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012

PB - IEEE Society

CY - s.l.

T2 - EuroSimE 2012

Y2 - 16 April 2012 through 18 April 2012

ER -

Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

Conference

Keywords

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Cite this