Standard

Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. / Sadeghinia, M; Jansen, KMB; Ernst, LJ; Pape, H.

Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l. : IEEE Society, 2012. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Sadeghinia, M, Jansen, KMB, Ernst, LJ & Pape, H 2012, Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. in Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. IEEE Society, s.l., pp. 1-4, EuroSimE 2012, Lisbon, Portugal, 16/04/12.

APA

Sadeghinia, M., Jansen, KMB., Ernst, LJ., & Pape, H. (2012). Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. In Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012 (pp. 1-4). IEEE Society.

Vancouver

Sadeghinia M, Jansen KMB, Ernst LJ, Pape H. Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. In Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l.: IEEE Society. 2012. p. 1-4

Author

Sadeghinia, M ; Jansen, KMB ; Ernst, LJ ; Pape, H. / Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition. Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012. s.l. : IEEE Society, 2012. pp. 1-4

BibTeX

@inproceedings{84b01bac6e2a47eaab8dc968109fe90a,
title = "Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition",
keywords = "Conf.proc. > 3 pag",
author = "M Sadeghinia and KMB Jansen and LJ Ernst and H Pape",
year = "2012",
language = "English",
isbn = "978-1-4673-1513-5",
pages = "1--4",
booktitle = "Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012",
publisher = "IEEE Society",
note = "EuroSimE 2012 : 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 16-04-2012 Through 18-04-2012",

}

RIS

TY - GEN

T1 - Establishing the interfacial fracture properties of cu-emc interfaces at harsh condition

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

AU - Pape, H

N1 - Conference code: 13

PY - 2012

Y1 - 2012

KW - Conf.proc. > 3 pag

UR - http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber=6191739&contentType=Conference+Publications

M3 - Conference contribution

SN - 978-1-4673-1513-5

SP - 1

EP - 4

BT - Proceedings of the 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and Microsystems, EuroSimE 2012

PB - IEEE Society

CY - s.l.

T2 - EuroSimE 2012

Y2 - 16 April 2012 through 18 April 2012

ER -

ID: 2191850