@inproceedings{4d0060c6c7bd48efb331ccf025586b3e,
title = "Establishment of the coarse grained parameters for epoxy-copper interfacial separation",
author = "KY Wong and YY Leung and RH Poelma and KMB Jansen and CA Yuan and {van Driel}, WD and GQ Zhang",
note = "neo; The 13th international conference on electronic packaging technology and high density packaging (ICEPT-HDP), Guilin, Guangxi, China ; Conference date: 13-08-2012 Through 16-08-2012",
year = "2012",
doi = "10.1109/ICEPT-HDP.2012.6474884",
language = "English",
isbn = "978-1-4673-1682-8",
publisher = "IEEE Society",
pages = "1467--1473",
editor = "s.n.",
booktitle = "Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference",
}