Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

D Yang; KMB Jansen; LJ Ernst; GQ Zhang; JGJ Beijer; JHJ Janssen

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

D Yang, KMB Jansen, LJ Ernst, GQ Zhang, JGJ Beijer, JHJ Janssen

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Editors	A Dziedzic, J Felba
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1-5
Number of pages	5
ISBN (Print)	0-7803-9553-0
Publication status	Published - 2005
Event	5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland - Piscataway Duration: 23 Oct 2005 → 26 Oct 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland
Period	23/10/05 → 26/10/05

Keywords

Conf.proc. > 3 pag

Cite this

Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ., & Janssen, JHJ. (2005). Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. In A. Dziedzic, & J. Felba (Eds.), Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (pp. 1-5). IEEE Society.

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author = "D Yang and KMB Jansen and LJ Ernst and GQ Zhang and JGJ Beijer and JHJ Janssen",

year = "2005",

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isbn = "0-7803-9553-0",

publisher = "IEEE Society",

pages = "1--5",

editor = "A Dziedzic and J Felba",

booktitle = "Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics",

note = "5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland ; Conference date: 23-10-2005 Through 26-10-2005",

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Yang, D, Jansen, KMB, Ernst, LJ, Zhang, GQ, Beijer, JGJ & Janssen, JHJ 2005, Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. in A Dziedzic & J Felba (eds), Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. IEEE Society, Piscataway, pp. 1-5, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 23/10/05.

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. / Yang, D; Jansen, KMB; Ernst, LJ et al.
Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. ed. / A Dziedzic; J Felba. Piscataway: IEEE Society, 2005. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

AU - Yang, D

AU - Jansen, KMB

AU - Ernst, LJ

AU - Zhang, GQ

AU - Beijer, JGJ

AU - Janssen, JHJ

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9553-0

SP - 1

EP - 5

BT - Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

A2 - Dziedzic, A

A2 - Felba, J

PB - IEEE Society

CY - Piscataway

T2 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland

Y2 - 23 October 2005 through 26 October 2005

ER -

Yang D, Jansen KMB, Ernst LJ, Zhang GQ, Beijer JGJ, Janssen JHJ. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. In Dziedzic A, Felba J, editors, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Piscataway: IEEE Society. 2005. p. 1-5