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Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips. / Rezaie Adli, AR; Jansen, KMB; Schindler-Saefkow, F; Rost, F.

Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. ed. / B Vandevelde. Piscataway : IEEE Society, 2014. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Rezaie Adli, AR, Jansen, KMB, Schindler-Saefkow, F & Rost, F 2014, Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips. in B Vandevelde (ed.), Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. IEEE Society, Piscataway, pp. 1-4, EuroSimE 2014, Ghent, Belgium, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813837

APA

Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F., & Rost, F. (2014). Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips. In B. Vandevelde (Ed.), Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (pp. 1-4). Piscataway: IEEE Society. https://doi.org/10.1109/EuroSimE.2014.6813837

Vancouver

Rezaie Adli AR, Jansen KMB, Schindler-Saefkow F, Rost F. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips. In Vandevelde B, editor, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Piscataway: IEEE Society. 2014. p. 1-4 https://doi.org/10.1109/EuroSimE.2014.6813837

Author

Rezaie Adli, AR ; Jansen, KMB ; Schindler-Saefkow, F ; Rost, F. / Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips. Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. editor / B Vandevelde. Piscataway : IEEE Society, 2014. pp. 1-4

BibTeX

@inproceedings{a36347712f4741768974677e8382bb5a,
title = "Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips",
author = "{Rezaie Adli}, AR and KMB Jansen and F Schindler-Saefkow and F Rost",
year = "2014",
doi = "10.1109/EuroSimE.2014.6813837",
language = "English",
isbn = "978-1-4799-4791-1",
pages = "1--4",
editor = "B Vandevelde",
booktitle = "Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems",
publisher = "IEEE Society",

}

RIS

TY - GEN

T1 - Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

AU - Rezaie Adli, AR

AU - Jansen, KMB

AU - Schindler-Saefkow, F

AU - Rost, F

PY - 2014

Y1 - 2014

U2 - 10.1109/EuroSimE.2014.6813837

DO - 10.1109/EuroSimE.2014.6813837

M3 - Conference contribution

SN - 978-1-4799-4791-1

SP - 1

EP - 4

BT - Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems

A2 - Vandevelde, B

PB - IEEE Society

CY - Piscataway

ER -

ID: 3742282