@inproceedings{b411a273436f4dd3b7678ad1960085de,
title = "Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "RCJ Vogels and M Huang and D Yang and {van Driel}, WD and GQ Zhang",
year = "2005",
language = "Undefined/Unknown",
isbn = "0-7803-9449-6",
publisher = "IEEE Society",
pages = "185--190",
editor = "Keyun and Bi and Chunqing and Wang",
booktitle = "Proceedings of 2005 6th International Conference on Electronic Packaging Technology",
note = "2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China ; Conference date: 30-08-2005 Through 02-09-2005",
}