Fast Qualification Using Thermal Shock Combined with Moisture Absorption

X Ma; GQ Zhang; KMB Jansen; WD van Driel; O van der Sluis; LJ Ernst; C Regard; C Gautier; H Frémont

Fast Qualification Using Thermal Shock Combined with Moisture Absorption

X Ma, GQ Zhang, KMB Jansen, WD van Driel, O van der Sluis, LJ Ernst, C Regard, C Gautier, H Frémont

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take a very long time. For example, moisture sensitivity level assessment (MSL 1) will take 168 hours pre conditioning at 85C/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times are chosen to ensure that also the thicker section of a package are completely saturated. Thinner packages, however, are already saturated after one to two days. In this study, we therefore investigated whether it would be possible to speed up the qualification process by shortening the preconditioning time. We focus in particular on the interface toughness. From our four point bending test and analysis, it is found that temperature has great effects on the interface toughness and moisture also has small effects on the interface toughness. In order to do the fast qualification test, thermal shock cycling tests combined with moisture absorption are performed. Experiments show that moisture can speed up the delamination.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China
Editors	Keyun Bi, Jian CaI
Publisher	IEEE Society
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4244-4659-9
Publication status	Published - 2009

Publication series

Name
Publisher	IEEE

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Ma, X., Zhang, GQ., Jansen, KMB., van Driel, WD., van der Sluis, O., Ernst, LJ., Regard, C., Gautier, C., & Frémont, H. (2009). Fast Qualification Using Thermal Shock Combined with Moisture Absorption. In Keyun Bi, & Jian CaI (Eds.), Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China (pp. 1-6). IEEE Society.

@inproceedings{578f8b4d87924724b88d05906c59445b,

title = "Fast Qualification Using Thermal Shock Combined with Moisture Absorption",

abstract = "Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take a very long time. For example, moisture sensitivity level assessment (MSL 1) will take 168 hours pre conditioning at 85C/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times are chosen to ensure that also the thicker section of a package are completely saturated. Thinner packages, however, are already saturated after one to two days. In this study, we therefore investigated whether it would be possible to speed up the qualification process by shortening the preconditioning time. We focus in particular on the interface toughness. From our four point bending test and analysis, it is found that temperature has great effects on the interface toughness and moisture also has small effects on the interface toughness. In order to do the fast qualification test, thermal shock cycling tests combined with moisture absorption are performed. Experiments show that moisture can speed up the delamination.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "X Ma and GQ Zhang and KMB Jansen and {van Driel}, WD and {van der Sluis}, O and LJ Ernst and C Regard and C Gautier and H Fr{\'e}mont",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4659-9",

publisher = "IEEE Society",

pages = "1--6",

editor = "{Keyun Bi} and {Jian CaI}",

booktitle = "Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China",

}

Ma, X, Zhang, GQ, Jansen, KMB , van Driel, WD, van der Sluis, O, Ernst, LJ, Regard, C, Gautier, C & Frémont, H 2009, Fast Qualification Using Thermal Shock Combined with Moisture Absorption. in Keyun Bi & Jian CaI (eds), Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. IEEE Society, pp. 1-6.

Fast Qualification Using Thermal Shock Combined with Moisture Absorption. / Ma, X; Zhang, GQ; Jansen, KMB et al.
Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, August 10-13, 2009, Beijing, China. ed. / Keyun Bi; Jian CaI. IEEE Society, 2009. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Fast Qualification Using Thermal Shock Combined with Moisture Absorption

AU - Ma, X

AU - Zhang, GQ

AU - Jansen, KMB

AU - van Driel, WD

AU - van der Sluis, O

AU - Ernst, LJ

AU - Regard, C

AU - Gautier, C

AU - Frémont, H

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N2 - Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take a very long time. For example, moisture sensitivity level assessment (MSL 1) will take 168 hours pre conditioning at 85C/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times are chosen to ensure that also the thicker section of a package are completely saturated. Thinner packages, however, are already saturated after one to two days. In this study, we therefore investigated whether it would be possible to speed up the qualification process by shortening the preconditioning time. We focus in particular on the interface toughness. From our four point bending test and analysis, it is found that temperature has great effects on the interface toughness and moisture also has small effects on the interface toughness. In order to do the fast qualification test, thermal shock cycling tests combined with moisture absorption are performed. Experiments show that moisture can speed up the delamination.

AB - Time to market is becoming one of the most important factors because of the fierce market competition. However, traditional reliability and interface toughness characterization tests take a very long time. For example, moisture sensitivity level assessment (MSL 1) will take 168 hours pre conditioning at 85C/85%RH and tradition thermal cycling takes even longer time. The long preconditioning times are chosen to ensure that also the thicker section of a package are completely saturated. Thinner packages, however, are already saturated after one to two days. In this study, we therefore investigated whether it would be possible to speed up the qualification process by shortening the preconditioning time. We focus in particular on the interface toughness. From our four point bending test and analysis, it is found that temperature has great effects on the interface toughness and moisture also has small effects on the interface toughness. In order to do the fast qualification test, thermal shock cycling tests combined with moisture absorption are performed. Experiments show that moisture can speed up the delamination.

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