Abstract
Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the interface of wire and bond pad.
This paper will present the finite element analysis of the copper wire bond process and IMC forming and results in the stress pattern shift during the processes.
Keywords: Cu wire bond, IC BE structure (BEOL), epoxy curing, IMC grow
Original language | English |
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Title of host publication | Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria |
Editors | LJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger |
Place of Publication | Linz, Austria |
Publisher | IEEE Society |
Pages | 1-5 |
Number of pages | 5 |
ISBN (Print) | 978-1-4577-0105-4 |
Publication status | Published - 2011 |
Event | EuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 Conference number: 12 |
Publication series
Name | |
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Publisher | IEEE |
Conference
Conference | EuroSimE 2011 |
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Country/Territory | Austria |
City | Linz |
Period | 18/04/11 → 20/04/11 |
Keywords
- conference contrib. refereed
- Conf.proc. > 3 pag