Original languageEnglish
Title of host publicationProceedings of the 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
EditorsW van Driel, et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)978-1-4673-6138-5
DOIs
Publication statusPublished - 2013
EventEuroSimE 2013 - Wroclaw, Poland
Duration: 14 Apr 201317 Apr 2013

Conference

ConferenceEuroSimE 2013
CountryPoland
CityWroclaw
Period14/04/1317/04/13

ID: 1271091