@inproceedings{16b39f77af384b7f8e506a831fc1d5cd,
title = "Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations",
author = "P Gromala and C Silber and KMB Jansen and LJ Ernst",
year = "2014",
language = "English",
isbn = "978-1-4799-6994-4",
publisher = "IEEE Society",
pages = "411--420",
editor = "A Yeo and {Hong Wan}, NG",
booktitle = "Proceedings of the16th Electronic Packaging Technology Conference - 2014",
note = "EPTC 2014, Marina Bay Sands, Singapore ; Conference date: 03-12-2014 Through 05-12-2014",
}