Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

P Gromala; C Silber; KMB Jansen; LJ Ernst

Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

P Gromala, C Silber, KMB Jansen, LJ Ernst

Mechanical Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the16th Electronic Packaging Technology Conference - 2014
Editors	A Yeo, NG Hong Wan
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	411-420
Number of pages	10
ISBN (Print)	978-1-4799-6994-4
Publication status	Published - 2014
Event	EPTC 2014, Marina Bay Sands, Singapore - Piscataway, NJ, USA Duration: 3 Dec 2014 → 5 Dec 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	EPTC 2014, Marina Bay Sands, Singapore
Period	3/12/14 → 5/12/14

Cite this

@inproceedings{16b39f77af384b7f8e506a831fc1d5cd,

title = "Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations",

author = "P Gromala and C Silber and KMB Jansen and LJ Ernst",

year = "2014",

language = "English",

isbn = "978-1-4799-6994-4",

publisher = "IEEE Society",

pages = "411--420",

editor = "A Yeo and {Hong Wan}, NG",

booktitle = "Proceedings of the16th Electronic Packaging Technology Conference - 2014",

note = "EPTC 2014, Marina Bay Sands, Singapore ; Conference date: 03-12-2014 Through 05-12-2014",

}

Gromala, P, Silber, C, Jansen, KMB & Ernst, LJ 2014, Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations. in A Yeo & NG Hong Wan (eds), Proceedings of the16th Electronic Packaging Technology Conference - 2014. IEEE Society, Piscataway, NJ, USA, pp. 411-420, EPTC 2014, Marina Bay Sands, Singapore, 3/12/14.

Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations. / Gromala, P; Silber, C; Jansen, KMB et al.
Proceedings of the16th Electronic Packaging Technology Conference - 2014. ed. / A Yeo; NG Hong Wan. Piscataway, NJ, USA: IEEE Society, 2014. p. 411-420.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

AU - Gromala, P

AU - Silber, C

AU - Jansen, KMB

AU - Ernst, LJ

PY - 2014

Y1 - 2014

UR - http://www.eptc-ieee.net/

M3 - Conference contribution

SN - 978-1-4799-6994-4

SP - 411

EP - 420

BT - Proceedings of the16th Electronic Packaging Technology Conference - 2014

A2 - Yeo, A

A2 - Hong Wan, NG

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - EPTC 2014, Marina Bay Sands, Singapore

Y2 - 3 December 2014 through 5 December 2014

ER -

Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

Publication series

Conference

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