Fracture and Delamination in Microelectronic Devices.

LJ Ernst, WD van Driel, O van der Sluis, A Corigliano, AAO Tay

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

Original language	English
Title of host publication	Smart systems integration and reliability.
Editors	Michel Bernd, Lang Klaus-Dieter
Place of Publication	Dresden
Publisher	Goldenbogen Verlag
Pages	634-663
Number of pages	824
ISBN (Print)	978-3-932434-77-8
Publication status	Published - 2010

NEO

Keywords

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title = "Fracture and Delamination in Microelectronic Devices.",

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TY - CHAP

T1 - Fracture and Delamination in Microelectronic Devices.

AU - Ernst, LJ

AU - van Driel, WD

AU - van der Sluis, O

AU - Corigliano, A

AU - Tay, AAO

N1 - NEO

PY - 2010

Y1 - 2010

KW - edited works: contributions

KW - Boekdeel internat.wet

M3 - Chapter

SN - 978-3-932434-77-8

SP - 634

EP - 663

BT - Smart systems integration and reliability.

A2 - Bernd, Michel

A2 - Klaus-Dieter, Lang

PB - Goldenbogen Verlag

CY - Dresden

ER -