Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

M Sadeghinia; KMB Jansen; LJ Ernst; G Schlottig; H Pape

Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

M Sadeghinia, KMB Jansen, LJ Ernst, G Schlottig, H Pape

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Abstract

Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure, i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening displacement under combined mode I/ II conditions on a bi-material specimen.

Original language	English
Title of host publication	Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria
Editors	LJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger
Place of Publication	Linz, Austria
Publisher	IEEE Society
Pages	1-5
Number of pages	5
ISBN (Print)	978-1-4577-0105-4
Publication status	Published - 2011
Event	EuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 Conference number: 12

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2011
Country/Territory	Austria
City	Linz
Period	18/04/11 → 20/04/11

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Sadeghinia, M., Jansen, KMB., Ernst, LJ., Schlottig, G., & Pape, H. (2011). Fracture toughness of Cu-EMC interfaces under pressure cooker conditions. In LJ. Ernst, GQ. Zhang, WD. V. Driel, P. Rodgers, C. Bailey, & O. D. Saint Leger (Eds.), Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria (pp. 1-5). IEEE Society.

Sadeghinia, M ; Jansen, KMB ; Ernst, LJ et al. / Fracture toughness of Cu-EMC interfaces under pressure cooker conditions. Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. editor / LJ Ernst ; GQ Zhang ; WD van Driel ; P Rodgers ; C Bailey ; O de Saint Leger. Linz, Austria : IEEE Society, 2011. pp. 1-5

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title = "Fracture toughness of Cu-EMC interfaces under pressure cooker conditions",

abstract = "Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure, i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening displacement under combined mode I/ II conditions on a bi-material specimen.",

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author = "M Sadeghinia and KMB Jansen and LJ Ernst and G Schlottig and H Pape",

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booktitle = "Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria",

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Sadeghinia, M, Jansen, KMB, Ernst, LJ, Schlottig, G & Pape, H 2011, Fracture toughness of Cu-EMC interfaces under pressure cooker conditions. in LJ Ernst, GQ Zhang, WDV Driel, P Rodgers, C Bailey & OD Saint Leger (eds), Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. IEEE Society, Linz, Austria, pp. 1-5, EuroSimE 2011, Linz, Austria, 18/04/11.

Fracture toughness of Cu-EMC interfaces under pressure cooker conditions. / Sadeghinia, M; Jansen, KMB; Ernst, LJ et al.
Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. ed. / LJ Ernst; GQ Zhang; WD van Driel; P Rodgers; C Bailey; O de Saint Leger. Linz, Austria: IEEE Society, 2011. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

AU - Schlottig, G

AU - Pape, H

N1 - Conference code: 12

PY - 2011

Y1 - 2011

N2 - Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure, i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening displacement under combined mode I/ II conditions on a bi-material specimen.

AB - Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure, i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening displacement under combined mode I/ II conditions on a bi-material specimen.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://www.eurosime.org

M3 - Conference contribution

SN - 978-1-4577-0105-4

SP - 1

EP - 5

BT - Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Driel, WD van

A2 - Rodgers, P

A2 - Bailey, C

A2 - Saint Leger, O de

PB - IEEE Society

CY - Linz, Austria

T2 - EuroSimE 2011

Y2 - 18 April 2011 through 20 April 2011

ER -

Sadeghinia M, Jansen KMB, Ernst LJ, Schlottig G, Pape H. Fracture toughness of Cu-EMC interfaces under pressure cooker conditions. In Ernst LJ, Zhang GQ, Driel WDV, Rodgers P, Bailey C, Saint Leger OD, editors, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Linz, Austria: IEEE Society. 2011. p. 1-5

Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

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