Abstract
Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture
toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 oC & 100% RH). To deal with it, a chamber with high pressure,
i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening
displacement under combined mode I/ II conditions on a bi-material specimen.
Original language | English |
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Title of host publication | Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria |
Editors | LJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger |
Place of Publication | Linz, Austria |
Publisher | IEEE Society |
Pages | 1-5 |
Number of pages | 5 |
ISBN (Print) | 978-1-4577-0105-4 |
Publication status | Published - 2011 |
Event | EuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 Conference number: 12 |
Publication series
Name | |
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Publisher | IEEE |
Conference
Conference | EuroSimE 2011 |
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Country/Territory | Austria |
City | Linz |
Period | 18/04/11 → 20/04/11 |
Keywords
- conference contrib. refereed
- Conf.proc. > 3 pag