In this paper, development and characterization of a free-standing electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 µm is plated into a photoresist mould realizing meander and mesh-like patterns. These are subsequently released resulting in a free-standing electrical interconnect that is optionally conformally coated by a -8 µm thick Parylene N layer. Parylene sealing provides electrical insulation and increases rigidity of the structures. Tensile tests on fabricated samples have shown the elongation capability up to 300% for the mesh design and more than 1000% for the meander design. The Parylene coated samples showed increased rigidity but about 50% reduced elongation. Furthermore, parameterized FEM simulations were performed in order to estimate stress levels for different geometries under tensile stress.
Original languageUndefined/Unknown
Title of host publication2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA
Editors Wipiejewski, T., Trewhella, J.
Place of PublicationOrlando, FL, USA
PublisherIEEE Society
Pages1339-1345
Number of pages7
ISBN (Print)978-1-4244-2231-9
Publication statusPublished - 2008
Event58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA
Duration: 27 May 200830 May 2008

Publication series

Name
PublisherIEEE

Conference

Conference58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Period27/05/0830/05/08

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3421648