@inproceedings{fd045bbdf9d3427095c98ee26a4f7f30,
title = "Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics",
abstract = "In this paper, development and characterization of a free-standing electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 µm is plated into a photoresist mould realizing meander and mesh-like patterns. These are subsequently released resulting in a free-standing electrical interconnect that is optionally conformally coated by a -8 µm thick Parylene N layer. Parylene sealing provides electrical insulation and increases rigidity of the structures. Tensile tests on fabricated samples have shown the elongation capability up to 300% for the mesh design and more than 1000% for the meander design. The Parylene coated samples showed increased rigidity but about 50% reduced elongation. Furthermore, parameterized FEM simulations were performed in order to estimate stress levels for different geometries under tensile stress.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "S Sosin and T Zoumpoulidis and M Bartek and L Wang and R Dekker and KMB Jansen and LJ Ernst",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2231-9",
publisher = "IEEE Society",
pages = "1339--1345",
editor = "{Wipiejewski, T.} and {Trewhella, J.}",
booktitle = "2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA",
note = "58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA ; Conference date: 27-05-2008 Through 30-05-2008",
}