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Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. / Santagata, F; Fiorentino, G; Nie, M; Farriciello, C; Poelma, RH; Zhang, GQ; Sarro, PM.

Proceedings 11th IEEE Sensors Conference. ed. / W Fang et al. Piscataway, NJ, USA : IEEE Society, 2012. p. 668-671.

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Harvard

Santagata, F, Fiorentino, G, Nie, M, Farriciello, C, Poelma, RH, Zhang, GQ & Sarro, PM 2012, Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. in W Fang et al (ed.), Proceedings 11th IEEE Sensors Conference. IEEE Society, Piscataway, NJ, USA, pp. 668-671, IEEE Sensors 2012, Taipei, Taiwan, Province of China, 28/10/12.

APA

Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, RH., Zhang, GQ., & Sarro, PM. (2012). Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. In W. Fang et al (Ed.), Proceedings 11th IEEE Sensors Conference (pp. 668-671). Piscataway, NJ, USA: IEEE Society.

Vancouver

Santagata F, Fiorentino G, Nie M, Farriciello C, Poelma RH, Zhang GQ et al. Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. In Fang et al W, editor, Proceedings 11th IEEE Sensors Conference. Piscataway, NJ, USA: IEEE Society. 2012. p. 668-671

Author

Santagata, F ; Fiorentino, G ; Nie, M ; Farriciello, C ; Poelma, RH ; Zhang, GQ ; Sarro, PM. / Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. Proceedings 11th IEEE Sensors Conference. editor / W Fang et al. Piscataway, NJ, USA : IEEE Society, 2012. pp. 668-671

BibTeX

@inproceedings{6ad6f3b924964a43891e669acf8d914a,
title = "Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "F Santagata and G Fiorentino and M Nie and C Farriciello and RH Poelma and GQ Zhang and PM Sarro",
note = "Onder dezelfde titel als artikel van 11 blz. in 2013 verschenen in J. Micromech. Microeng; met verschillende auteurs.",
year = "2012",
language = "English",
publisher = "IEEE Society",
pages = "668--671",
editor = "{Fang et al}, W",
booktitle = "Proceedings 11th IEEE Sensors Conference",

}

RIS

TY - GEN

T1 - Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

AU - Santagata, F

AU - Fiorentino, G

AU - Nie, M

AU - Farriciello, C

AU - Poelma, RH

AU - Zhang, GQ

AU - Sarro, PM

N1 - Onder dezelfde titel als artikel van 11 blz. in 2013 verschenen in J. Micromech. Microeng; met verschillende auteurs.

PY - 2012

Y1 - 2012

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

UR - http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06411433

M3 - Conference contribution

SP - 668

EP - 671

BT - Proceedings 11th IEEE Sensors Conference

A2 - Fang et al, W

PB - IEEE Society

CY - Piscataway, NJ, USA

ER -

ID: 3580204