In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.
Original languageUndefined/Unknown
Title of host publicationProceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors Sheng Liu
Place of PublicationShanghai, China
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages123-129
Number of pages7
ISBN (Print)1-4244-0620-X
Publication statusPublished - 2006
Event2006 7th International Conference on Electronics Packaging Technology - Shanghai. China
Duration: 26 Aug 200629 Aug 2006

Publication series

Name
PublisherInstitute of Electrical and Electronics Engineers, Inc.

Conference

Conference2006 7th International Conference on Electronics Packaging Technology
Period26/08/0629/08/06

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 3164850